公开(公告)号：US07833841B2

公开(公告)日：2010-11-16

申请号：US12187601

申请日：2008-08-07

Applicant: Hidehiko Kando ,  Isao Sakama

Inventor： Hidehiko Kando ,  Isao Sakama

IPC: H01L21/82

CPC classification number: H01L22/34 ,  H01L2924/3011

Abstract: The present invention is a method for manufacturing a semiconductor apparatus including a chip which is fabricated in large numbers on a wafer and has a plurality of information blocks. In the method, a unique information bit is written in a chip discrimination block of each chip within a shot, which is a segmented region of the wafer, by a fixed pattern method. In addition, an information bit uniquely given to each shot within the wafer is written by a mask shift method. Further, an information bit uniquely given to each wafer is written in a wafer discrimination block of the chip which is fabricated on the wafer by the mask shift method and mask combination method.

Abstract translation: 本发明是一种制造半导体装置的方法，该半导体装置包括大量制造在晶片上并具有多个信息块的芯片。 在该方法中，通过固定图案方式，在作为晶片的分割区域的镜头内的每个芯片的芯片鉴别块中写入唯一的信息位。 此外，通过掩模移位方法写入唯一给予晶片内的每个镜头的信息位。 此外，通过掩模移位方法和掩模组合方法，在晶片上制造的芯片的晶片鉴别块中写入唯一给每个晶片的信息位。

公开(公告)号：US07602289B2

公开(公告)日：2009-10-13

申请号：US11316805

申请日：2005-12-27

Applicant: Minoru Ashizawa ,  Isao Sakama

Inventor： Minoru Ashizawa ,  Isao Sakama

IPC: G08B13/14

CPC classification number: H01R29/00 ,  H01R9/2475 ,  H01R13/6691 ,  H01R13/7038

Abstract: A connector device used for electrical connection between electrical devices, including: a first connector; an IC chip disposed in a casing of the first connector; a first antenna disposed in the casing of the first connector, for wirelessly transmitting ID data of the IC chip stored in the IC chip in response to a signal from an external device; a second connector detachable from the first connector, electrically connecting the electrical devices when coupled to the first connector; and a second antenna disposed in a casing of the second connector, brought close to the first antenna to amplify and transmit a radio wave from the first antenna, when the first and second connectors are normally coupled together.

Abstract translation: 一种用于电气设备之间的电连接的连接器装置，包括：第一连接器; 设置在所述第一连接器的壳体中的IC芯片; 第一天线，设置在所述第一连接器的壳体中，用于响应于来自外部设备的信号，无线地发送存储在所述IC芯片中的IC芯片的ID数据; 第二连接器，其可从所述第一连接器拆卸，当连接到所述第一连接器时电连接所述电气装置; 以及当所述第一和第二连接器通常耦合在一起时，设置在所述第二连接器的壳体中的第二天线靠近所述第一天线放大并发射来自所述第一天线的无线电波。

公开(公告)号：US07523541B2

公开(公告)日：2009-04-28

申请号：US12076030

申请日：2008-03-13

Applicant: Isao Sakama ,  Minoru Ashizawa

Inventor： Isao Sakama ,  Minoru Ashizawa

IPC: H01P11/00

CPC classification number: H01Q1/22 ,  H01Q9/285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49169

Abstract: Method for manufacturing a small radio frequency IC tag, where the radio frequency IC tag which can obtain sufficiently long communication distance with radio wave in the microwave band even if an antenna is made small and the radio frequency IC tag is embedded in metal material. An O-shaped antenna is formed to narrow the width of a neck part in which an IC chip is mounted and widen the width of radiating electrodes constituting radiating part of radio wave. The radiating electrodes are formed into offset structure on right and left sides of the feeding point so that areas of right and left radiating parts of the feeding point in which the IC chip is mounted are unsymmetrical. Further, a ground electrode is provided so that a dielectric body is held between the radiating electrodes and the ground electrode and the radiating electrode is connected to the ground electrode at the side of the dielectric body.

Abstract translation: 制造小型射频IC标签的方法，其中即使天线小，并且射频IC标签嵌入在金属材料中，即使在微波频带中也能够获得足够长的与无线电波的通信距离的射频IC标签。 形成O形天线以使安装有IC芯片的颈部的宽度变窄，并且扩大构成无线电波的辐射部分的辐射电极的宽度。 辐射电极在馈电点的左右两侧形成偏移结构，使得安装IC芯片的馈电点的左右辐射部分的区域不对称。 此外，设置接地电极，使得电介质体保持在辐射电极和接地电极之间，并且辐射电极连接到介电体侧面的接地电极。

公开(公告)号：US20090027210A1

公开(公告)日：2009-01-29

申请号：US12039453

申请日：2008-02-28

Applicant: Isao SAKAMA ,  Koichi Tachibana

Inventor： Isao SAKAMA ,  Koichi Tachibana

IPC: G08B13/22

CPC classification number: G06K19/07749 ,  G06K19/07756 ,  G06K19/0776 ,  G06K19/07794

Abstract: In an RFID tag mounting package mounted with an RFID tag and a manufacturing method thereof, in order to have sufficient communication performance without spoiling the design property of the package to which a conductive film is applied, a package is obtained by assembling a structural material in which a metallic film is formed on a base material made of paper or the like. In the package, a slot is provided in the metallic film of a folded portion, in a spot where portions (the folded portion and an external packaging portion) of the structural material overlap each other. An inlet operates as an RFID tag, includes an antenna and an IC chip connected to the antenna, and is mounted on the inner surface of the folded portion in conformity with the position of the slot.

Abstract translation: 在安装有RFID标签的RFID标签安装封装及其制造方法中，为了具有足够的通信性能而不破坏施加导电膜的封装的设计特性，通过将结构材料组装在 在由纸等制成的基材上形成金属膜。 在封装中，在折叠部分的金属膜中，在结构材料的部分（折叠部分和外部包装部分）彼此重叠的位置处设置有槽。 入口作为RFID标签进行操作，包括天线和连接到天线的IC芯片，并且根据槽的位置安装在折叠部分的内表面上。

公开(公告)号：US20080030902A1

公开(公告)日：2008-02-07

申请号：US11739257

申请日：2007-04-24

Applicant: Isao Sakama ,  Minoru Ashizawa

Inventor： Isao Sakama ,  Minoru Ashizawa

IPC: G11B5/48

CPC classification number: G11B23/0042 ,  G06K19/045 ,  G11B23/0305 ,  H01Q1/22 ,  H01Q13/08 ,  H01Q13/10

Abstract: A disk media has an IC chip which is mounted thereon at a boundary peripheral portion of a metal film layer formation region with respect to a metal film layer non-formation region. The IC chip is mounted on a top surface of the metal film layer. An “L”-shaped slit is formed in the metal film layer at the mount position of the IC chip while causing signal input/output electrodes of IC chip to be connected to portions of the metal film layer which are placed on the opposite sides of the slit. With such an arrangement, it is possible to use the metal film layer as an antenna of IC chip while enabling the impedance of IC chip to match the impedance of the antenna formed by the metal film layer.

Abstract translation: 磁盘介质在相对于金属膜层非形成区域的金属膜层形成区域的边界周边部分安装有IC芯片。 IC芯片安装在金属膜层的顶面上。 在IC芯片的安装位置的金属膜层中形成“L”形狭缝，同时使IC芯片的信号输入/输出电极连接到金属膜层的位于相对侧的部分 狭缝。 通过这样的布置，可以使金属膜层作为IC芯片的天线，同时能够使IC芯片的阻抗匹配由金属膜层形成的天线的阻抗。

公开(公告)号：US20060267843A1

公开(公告)日：2006-11-30

申请号：US11300282

申请日：2005-12-15

Applicant: Isao Sakama ,  Minoru Ashizawa

Inventor： Isao Sakama ,  Minoru Ashizawa

IPC: H01Q1/38

CPC classification number: H01Q1/22 ,  H01Q9/285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49169

Abstract: A small radio frequency IC tag which can obtain sufficiently long communication distance with radio wave in the microwave band even if an antenna is made small and the radio frequency IC tag is embedded in metal material. An O-shaped antenna is formed to narrow the width of a neck part in which an IC chip is mounted and widen the width of radiating electrodes constituting radiating part of radio wave. The radiating electrodes are formed into offset structure on right and left sides of the feeding point so that areas of right and left radiating parts of the feeding point in which the IC chip is mounted are unsymmetrical. Further, a ground electrode is provided so that a dielectric body is held between the radiating electrodes and the ground electrode and the radiating electrode is connected to the ground electrode at the side of the dielectric body.

Abstract translation: 即使天线小，射频IC标签嵌入金属材料中，也能够在微波频带中与无线电波获得足够长的通信距离的小射频IC标签。 形成O形天线以使安装有IC芯片的颈部的宽度变窄，并且扩大构成无线电波的辐射部分的辐射电极的宽度。 辐射电极在馈电点的左右两侧形成偏移结构，使得安装IC芯片的馈电点的左右辐射部分的区域不对称。 此外，设置接地电极，使得电介质体保持在辐射电极和接地电极之间，并且辐射电极连接到介电体侧面的接地电极。

公开(公告)号：US20050275539A1

公开(公告)日：2005-12-15

申请号：US11052804

申请日：2005-02-09

Applicant: Isao Sakama ,  Minoru Ashizawa

Inventor： Isao Sakama ,  Minoru Ashizawa

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/28 ,  H01Q19/00 ,  G08B13/14

CPC classification number: G06K19/07786 ,  G06K19/07756 ,  H01Q1/2225 ,  H01Q7/00 ,  H01Q9/285 ,  H01Q19/00 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T156/1052

Abstract: A radio frequency IC tag and a manufacturing method for the same includes an IC chip on which information is stored, and an antenna for transmitting the information that is stored on the IC chip. In the antenna, a power-feeding part on which the IC chip is mounted extends along a direction in which an electric current flows. Radiation parts are formed so that the width of the radiation parts becomes wider than that of the power-feeding part with respect to the longitudinal axis of the power-feeding part. The radiation parts extend from the power-feeding part, at both sides thereof, along the direction in which the electric current flows.

Abstract translation: 射频IC标签及其制造方法包括存储有信息的IC芯片和用于发送存储在IC芯片上的信息的天线。 在天线中，安装IC芯片的供电部分沿着电流流过的方向延伸。 辐射部分被形成为使得辐射部分的宽度相对于馈电部分的纵向轴线的宽度变得比供电部分的宽度宽。 辐射部分沿着电流流动的方向从供电部分的两侧延伸。

公开(公告)号：US08115638B2

公开(公告)日：2012-02-14

申请号：US12392158

申请日：2009-02-25

Applicant: Isao Sakama

Inventor： Isao Sakama

IPC: G08B13/14

CPC classification number: G06K19/07749

Abstract: An RFID thread which is mounted on a sheet and whose predetermined information can be read wirelessly from outside, the RFID thread includes: an IC chip recording the predetermined information; a first antenna consisting of an electrically continuous conductor which has a length corresponding to a size of the sheet and on which one or a plurality of the IC chips are mounted; and a base film made of resin for supporting the first antenna.

Abstract translation: RFID线程安装在片材上，其预定信息可以从外部无线地读取，RFID线程包括：记录预定信息的IC芯片; 由电连续导体组成的第一天线，其长度对应于片材的尺寸，并且其上安装有一个或多个IC芯片; 以及由用于支撑第一天线的树脂制成的基膜。

公开(公告)号：US20120024959A1

公开(公告)日：2012-02-02

申请号：US13077390

申请日：2011-03-31

Applicant: Madoka MINAGAWA ,  Naoya KANDA ,  Isao SAKAMA ,  Shigeru SAGAWA ,  Daisuke SHIBATA

Inventor： Madoka MINAGAWA ,  Naoya KANDA ,  Isao SAKAMA ,  Shigeru SAGAWA ,  Daisuke SHIBATA

IPC: G06K19/077 ,  H01L21/98

CPC classification number: H01Q1/2208 ,  G06K19/0772 ,  G06K19/07722 ,  G06K19/07754 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: An RFID inlet by including: a base film; an antenna pattern formed on the base film; an insulation film layer formed on the antenna pattern and having a hole; an IC chip coupled to the antenna pattern inside the hole of the insulation film layer; and an underfill filled between the IC chip, the antenna, and the base film. The height of the IC chip top surface is at a higher level than the top surface of the insulation film layer, the underfill is formed between the IC chip and a wall surface of the hole of the insulation film layer.

Abstract translation: 一种RFID入口，包括：基膜; 形成在基膜上的天线图案; 形成在所述天线图案上并具有孔的绝缘膜层; IC芯片，耦合到绝缘膜层的孔内的天线图案; 以及填充在IC芯片，天线和基膜之间的底部填充物。 IC芯片顶面的高度比绝缘膜层的顶面高，在IC芯片与绝缘膜层的孔的壁面之间形成底部填充物。

公开(公告)号：US08035524B2

公开(公告)日：2011-10-11

申请号：US12039453

申请日：2008-02-28

Applicant: Isao Sakama ,  Koichi Tachibana

Inventor： Isao Sakama ,  Koichi Tachibana

IPC: G08B13/14

CPC classification number: G06K19/07749 ,  G06K19/07756 ,  G06K19/0776 ,  G06K19/07794

Abstract: In an RFID tag mounting package mounted with an RFID tag and a manufacturing method thereof, in order to have sufficient communication performance without spoiling the design property of the package to which a conductive film is applied, a package is obtained by assembling a structural material in which a metallic film is formed on a base material made of paper or the like. In the package, a slot is provided in the metallic film of a folded portion, in a spot where portions (the folded portion and an external packaging portion) of the structural material overlap each other. An inlet operates as an RFID tag, includes an antenna and an IC chip connected to the antenna, and is mounted on the inner surface of the folded portion in conformity with the position of the slot.

Abstract translation: 在安装有RFID标签的RFID标签安装封装及其制造方法中，为了具有足够的通信性能而不破坏施加导电膜的封装的设计特性，通过将结构材料组装在 在由纸等制成的基材上形成金属膜。 在封装中，在折叠部分的金属膜中，在结构材料的部分（折叠部分和外部包装部分）彼此重叠的位置处设置有槽。 入口作为RFID标签进行操作，包括天线和连接到天线的IC芯片，并且根据槽的位置安装在折叠部分的内表面上。