A system and method for wafer level adjusting of IC chips are disclosed. The system and method for a wafer level adjustment of IC chips connect the analog circuits of the IC chip with the adjustment controller outside the semiconductor wafer via the probing region and the signal transmission region outside the IC chip, measure and adjust the performance of the IC chip by the adjustment controller, and then, only store final adjustment data in the adjustment memory of the IC chip. Accordingly, it is possible to reduce the area of adjustment circuits added to an integrated circuit chip such as an RFID tag chip and adjust the performance of chips at a wafer level.