发明申请
- 专利标题: ROTARY MAGNET SPUTTERING APPARATUS
- 专利标题(中): 旋转磁铁溅射装置
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申请号: US12593660申请日: 2008-03-28
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公开(公告)号: US20100126852A1公开(公告)日: 2010-05-27
- 发明人: Tadahiro Ohmi , Tetsuya Goto , Takaaki Matsuoka
- 申请人: Tadahiro Ohmi , Tetsuya Goto , Takaaki Matsuoka
- 申请人地址: JP Sendai-shi, Miyagi JP Tokyo
- 专利权人: NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY,TOKYO ELECTRON LIMITED
- 当前专利权人: NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY,TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Sendai-shi, Miyagi JP Tokyo
- 优先权: JP2007-092058 20070330
- 国际申请: PCT/JP2008/056139 WO 20080328
- 主分类号: C23C14/35
- IPC分类号: C23C14/35
摘要:
In a rotary magnet sputtering apparatus, a target consumption displacement quantity is measured, and corresponding to the measurement results, a distance between a rotating magnet group and a target is adjusted, and uniform film forming rate is achieved over a long period of time so as to reduce the change of a target surface due to consumption of the target and to reduce the change of the film forming rate with time. An ultrasonic sensor or a laser transmitting/receiving device may be used as a means for measuring the consumption displacement quantity of the target.
公开/授权文献
- US08496792B2 Rotary magnet sputtering apparatus 公开/授权日:2013-07-30
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