发明申请
US20100126852A1 ROTARY MAGNET SPUTTERING APPARATUS 有权
旋转磁铁溅射装置

ROTARY MAGNET SPUTTERING APPARATUS
摘要:
In a rotary magnet sputtering apparatus, a target consumption displacement quantity is measured, and corresponding to the measurement results, a distance between a rotating magnet group and a target is adjusted, and uniform film forming rate is achieved over a long period of time so as to reduce the change of a target surface due to consumption of the target and to reduce the change of the film forming rate with time. An ultrasonic sensor or a laser transmitting/receiving device may be used as a means for measuring the consumption displacement quantity of the target.
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