发明申请
US20100129984A1 WAFER SINGULATION IN HIGH VOLUME MANUFACTURING
审中-公开
WAVER SINGULATION IN HIGH VOLUME MANUFACTURING
- 专利标题： WAFER SINGULATION IN HIGH VOLUME MANUFACTURING
- 专利标题（中）： WAVER SINGULATION IN HIGH VOLUME MANUFACTURING
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申请号： US12324692申请日： 2008-11-26
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公开(公告)号： US20100129984A1公开(公告)日： 2010-05-27
- 发明人: George Vakanas , George Chen , Yuval Greenzweig , Eric Li , Sergei Voronov
- 申请人： George Vakanas , George Chen , Yuval Greenzweig , Eric Li , Sergei Voronov
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; B23K26/02
摘要：
The present invention discloses an apparatus including: a laser beam directed at a wafer held by a chuck in a process chamber; a focusing mechanism for the laser beam; a steering mechanism for the laser beam; an optical scanning mechanism for the laser beam; a mechanical scanning system for the chuck; an etch chemical induced by the laser beam to etch the wafer and form volatile byproducts; a gas feed line to dispense the etch chemical towards the wafer; and a gas exhaust line to remove any excess of the etch chemical and the volatile byproducts.
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