Laser-assisted chemical singulation of a wafer
    1.
    发明申请
    Laser-assisted chemical singulation of a wafer 有权
    激光辅助化学切片晶片

    公开(公告)号:US20100099238A1

    公开(公告)日:2010-04-22

    申请号:US12288627

    申请日:2008-10-22

    IPC分类号: H01L21/78 B23K26/38

    摘要: The present invention discloses an apparatus including: a laser beam directed at a wafer held by a chuck mounted on a stage inside a process chamber; a focusing mechanism for the laser beam; a steering mechanism for the laser beam; an optical scanning mechanism for the laser beam; a mechanical scanning system for the stage; an etch chemical induced by the laser beam to etch the wafer and form volatile byproducts; a gas feed line to dispense the etch chemical towards the wafer; and a gas exhaust line to remove any excess of the etch chemical and the volatile byproducts.

    摘要翻译: 本发明公开了一种装置,包括:激光束,其被引导到由安装在处理室内的台上的卡盘保持的晶片; 用于激光束的聚焦机构; 用于激光束的转向机构; 用于激光束的光学扫描机构; 用于舞台的机械扫描系统; 由激光束引起的刻蚀化学蚀刻以蚀刻晶片并形成挥发性副产物; 用于将蚀刻化学品分配给晶片的气体供给管线; 和排气管线,以除去任何过量的蚀刻化学品和挥发性副产物。

    Laser-assisted chemical singulation of a wafer
    3.
    发明授权
    Laser-assisted chemical singulation of a wafer 有权
    激光辅助化学切片晶片

    公开(公告)号:US08426250B2

    公开(公告)日:2013-04-23

    申请号:US12288627

    申请日:2008-10-22

    IPC分类号: H01L21/78

    摘要: The present invention discloses an apparatus including: a laser beam directed at a wafer held by a chuck mounted on a stage inside a process chamber; a focusing mechanism for the laser beam; a steering mechanism for the laser beam; an optical scanning mechanism for the laser beam; a mechanical scanning system for the stage; an etch chemical induced by the laser beam to etch the wafer and form volatile byproducts; a gas feed line to dispense the etch chemical towards the wafer; and a gas exhaust line to remove any excess of the etch chemical and the volatile byproducts.

    摘要翻译: 本发明公开了一种装置,包括:激光束,其被引导到由安装在处理室内的台上的卡盘保持的晶片; 用于激光束的聚焦机构; 用于激光束的转向机构; 用于激光束的光学扫描机构; 用于舞台的机械扫描系统; 由激光束引起的刻蚀化学蚀刻以蚀刻晶片并形成挥发性副产物; 用于将蚀刻化学品分配给晶片的气体供给管线; 和排气管线,以除去任何过量的蚀刻化学品和挥发性副产物。

    Focused ion beam deposition
    5.
    发明申请
    Focused ion beam deposition 审中-公开
    聚焦离子束沉积

    公开(公告)号:US20060051508A1

    公开(公告)日:2006-03-09

    申请号:US11260790

    申请日:2005-10-26

    IPC分类号: C23C16/00

    摘要: Introducing at least one metal such as cobalt, molybdenum, metal carbonyl, tungsten, platinum, or other suitable metal into a chamber containing a substrate. Contacting the substrate with a focused ion beam introduced into the chamber. Forming at least one layer over the substrate. Applying heat to the layer by, for example, a laser.

    摘要翻译: 将至少一种金属如钴,钼,金属羰基,钨,铂或其它合适的金属引入含有基底的室中。 将基板与引入腔室的聚焦离子束接触。 在基底上形成至少一层。 通过例如激光将热量施加到该层。