发明申请
- 专利标题: Thermosetting Resin Composition
- 专利标题(中): 热固性树脂组合物
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申请号: US11991851申请日: 2006-08-23
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公开(公告)号: US20100130697A1公开(公告)日: 2010-05-27
- 发明人: Atsuhiko Katayama , Niranjan Kumar Shrestha
- 申请人: Atsuhiko Katayama , Niranjan Kumar Shrestha
- 优先权: JP2005-265821 20050913
- 国际申请: PCT/JP2006/316485 WO 20060823
- 主分类号: C08L85/00
- IPC分类号: C08L85/00 ; C08L73/00
摘要:
Disclosed is a thermosetting resin composition of excellent low-temperature curability comprising an oxetane compound and also disclosed is a cured article obtained therefrom. The thermosetting resin composition comprises an oxetane compound (A) containing two or more oxetane functional groups in the molecule represented by the following general formula (1) and a heteropolyacid (B) as essential components. A cured article obtained by heat curing of this composition shows excellent mechanical properties, electrical properties, adhesive properties, resustance to heat, moisture, and chemicals, and the like. In formula (1), R1 is a hydrogen atom, alkyl group of 1 to 6 carbon atoms, fluorine atom, fluoroalkyl group of 1 to 6 carbon atoms, allyl group, aryl group, aralkyl group, furyl group, or thienyl group.
公开/授权文献
- US08008429B2 Thermosetting resin composition 公开/授权日:2011-08-30