Invention Application
- Patent Title: Printed circuit board having metal bump and method of manufacring the same
- Patent Title (中): 具有金属凸块的印刷电路板及其制造方法
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Application No.: US12379684Application Date: 2009-02-26
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Publication No.: US20100132985A1Publication Date: 2010-06-03
- Inventor: Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
- Applicant: Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0119895 20081128
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/20 ; H05K1/11
Abstract:
The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.
Public/Granted literature
- US08141241B2 Method of manufacturing a printed circuit board having metal bumps Public/Granted day:2012-03-27
Information query
