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公开(公告)号：US20110061912A1
公开(公告)日：2011-03-17
申请号：US12654668
申请日：2009-12-29
Applicant: Myung Sam Kang , Mi Sun Hwang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
Inventor： Myung Sam Kang , Mi Sun Hwang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
CPC classification number: H05K3/4611 , H05K3/045 , H05K3/4069 , H05K3/421 , H05K3/4652 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09518 , H05K2201/096 , H05K2203/1461 , H05K2203/1536 , Y10T156/10
Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.
Abstract translation: 提供了一种印刷电路板（PCB）及其制造方法。 PCB包括堆叠结构，其包括其间插入有第一绝缘层的第二绝缘层和第三绝缘层，以及具有第一至第四导电通孔的导电通孔。 在第一绝缘层中埋设第二层电路图形和第三层电路图案，在第二绝缘层上形成第一层电路图案，在第三绝缘层上形成第四层电路图形。 第一导电通孔连接第一层电路图案和第二层电路图案，第二导电通孔连接第一层电路图案和第三层电路图案，第三导电通孔连接第二层电路图案和 第四层电路图案和第四导电通孔连接第三层电路图案和第四层电路图案。
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2.发明申请PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME 审中-公开印刷电路板，包含该印刷电路板的半导体器件及其制造方法公开(公告)号：US20100314755A1
公开(公告)日：2010-12-16
申请号：US12511723
申请日：2009-07-29
Applicant: Myung Sam KANG , Mi Sun Hwang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
Inventor： Myung Sam KANG , Mi Sun Hwang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
IPC: H01L23/498 , H05K1/11 , B05D5/12 , B32B38/00
CPC classification number: H05K3/46 , B32B2309/10 , B32B2457/14 , H01L23/13 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/73215 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H05K3/0064 , H05K3/205 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.
Abstract translation: 公开了一种印刷电路板，其包括嵌入在一个表面中的绝缘层的第一电路层，并且包括凸块焊盘和引线接合焊盘，从而实现高密度导线焊盘。 还提供了包括印刷电路板的半导体器件和制造印刷电路板的方法。
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公开(公告)号：US08881381B2
公开(公告)日：2014-11-11
申请号：US12631594
申请日：2009-12-04
Applicant: Mi Sun Hwang , Myung Sam Kang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
Inventor： Mi Sun Hwang , Myung Sam Kang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
CPC classification number: H05K3/4685 , H05K3/0097 , H05K3/205 , H05K3/421 , H05K2201/0376 , H05K2203/0152 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.
Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：制备第一载体，其包括在其一侧上形成的第一图案; 制备包括在其一侧上顺序形成的第一阻焊层和第二图案的第二载体; 按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且将第二图案嵌入绝缘层的另一侧，然后移除第一载体和第二载体以制造两个基板 ; 使用粘合层将两个基板彼此连接，使得第一阻焊层彼此面对; 以及形成用于在绝缘层中连接第一图案与第二图案的通孔，在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。
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公开(公告)号：US20110067233A1
公开(公告)日：2011-03-24
申请号：US12654669
申请日：2009-12-29
Applicant: Seon Ha Kang , Myung Sam Kang , Mi Sun Hwang , Kil Yong Yun , Min Jung Cho , Gil Yong Shin , Ok Tae Kim
Inventor： Seon Ha Kang , Myung Sam Kang , Mi Sun Hwang , Kil Yong Yun , Min Jung Cho , Gil Yong Shin , Ok Tae Kim
IPC: H05K3/10
CPC classification number: H05K3/465 , H05K3/0041 , H05K3/045 , H05K3/064 , H05K3/107 , H05K3/108 , H05K3/4602 , H05K3/4611 , H05K2201/09036 , Y10T29/49155
Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.
Abstract translation: 一种制造印刷电路板的方法，所述方法包括：提供具有形成有第一电路图案的第一表面的绝缘基体和与所述第一表面相对的第二表面; 将绝缘基体的第一表面压在绝缘层的至少一个表面上，使得第一电路图案嵌入绝缘层中; 在绝缘基体的第二表面上形成具有所需图案的抗蚀剂; 通过在其上形成有抗蚀剂的绝缘基体的第二表面上进行等离子体处理来形成沟槽; 以及通过用导电材料填充所述沟槽来形成第二电路图案。 因此，可以使用简单的工艺形成导电图案，从而提高处理速度和生产率。
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5.发明申请公开(公告)号：US20100132985A1
公开(公告)日：2010-06-03
申请号：US12379684
申请日：2009-02-26
Applicant: Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
Inventor： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
CPC classification number: H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
Abstract: The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.
Abstract translation: 本发明涉及具有均匀高度的金属凸块并且直接连接到电路图案的印刷电路板，而不使用额外的凸块，从而允许以细间距进行布置。
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Patent Agency Ranking
公开(公告)号：US08141241B2
公开(公告)日：2012-03-27
申请号：US12379684
申请日：2009-02-26
Applicant: Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
Inventor： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
CPC classification number: H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.
Abstract translation: 一种制造具有金属凸块的印刷电路板的方法，包括：在金属载体上形成用于形成金属凸块的凹槽; 在包括所述凹部的所述金属载体上形成阻挡层; 在所述阻挡层上形成上层电路层，所述上层电路层包括填充在所述凹部中的所述金属凸块和电路图案; 制备绝缘层，并将上电路层转移到绝缘层; 并移除金属载体和阻挡层。
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公开(公告)号：US20110061231A1
公开(公告)日：2011-03-17
申请号：US12631594
申请日：2009-12-04
Applicant: Mi Sun HWANG , Myung Sam KANG , Ok Tae KIM , Seon Ha KANG , Gil Yong SHIN , Kil Yong YUN , Min Jung CHO
Inventor： Mi Sun HWANG , Myung Sam KANG , Ok Tae KIM , Seon Ha KANG , Gil Yong SHIN , Kil Yong YUN , Min Jung CHO
CPC classification number: H05K3/4685 , H05K3/0097 , H05K3/205 , H05K3/421 , H05K2201/0376 , H05K2203/0152 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.
Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：制备第一载体，其包括在其一侧上形成的第一图案; 制备包括在其一侧上顺序形成的第一阻焊层和第二图案的第二载体; 按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且将第二图案嵌入绝缘层的另一侧，然后移除第一载体和第二载体以制造两个基板 ; 使用粘合层将两个基板彼此连接，使得第一阻焊层彼此面对; 以及形成用于在绝缘层中连接第一图案与第二图案的通孔，在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。
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公开(公告)号：US09078344B2
公开(公告)日：2015-07-07
申请号：US13484823
申请日：2012-05-31
Applicant: Kyung Don Mun , Kil Yong Yun
Inventor： Kyung Don Mun , Kil Yong Yun
CPC classification number: H05K3/007 , H05K1/116 , H05K3/0097 , H05K3/045 , H05K3/4652 , H05K2201/0376 , H05K2201/09509 , H05K2201/09545 , Y10T29/49126
Abstract: A printed circuit board includes: a first insulating layer; a second insulating layer of which one surface is formed to be in contact with the other surface of the first insulating layer; a first circuit pattern formed to be embedded in one surface of the first insulating layer; a second circuit pattern formed to be embedded between the first insulating layer and the second insulating layer; a third circuit pattern formed to be protruded from the other surface of the second insulating layer; and a landless fill-plating layer for filling a hole which penetrates the first insulating layer.
Abstract translation: 印刷电路板包括：第一绝缘层; 一个表面形成为与第一绝缘层的另一个表面接触的第二绝缘层; 形成为嵌入在所述第一绝缘层的一个表面中的第一电路图案; 形成为嵌入在所述第一绝缘层和所述第二绝缘层之间的第二电路图案; 形成为从所述第二绝缘层的另一个表面突出的第三电路图案; 以及用于填充贯穿第一绝缘层的孔的无地填充镀层。
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公开(公告)号：US08464423B2
公开(公告)日：2013-06-18
申请号：US13373387
申请日：2011-11-14
Applicant: Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
Inventor： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
CPC classification number: H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.
Abstract translation: 一种制造具有金属凸块的印刷电路板的方法，包括：在第一载体上形成用于形成金属凸块的凹部，在第一载体上形成第一阻挡层，并在第一阻挡层上形成上电路层 所述上电路层包括充电在所述凹部中的金属凸块和电路图案; 在第二载体上形成第二阻挡层，并在第二阻挡层上形成下电路层; 制备绝缘层，并将上下电路层转移到绝缘层; 移除第一和第二载体; 以及去除所述第一和第二阻挡层。
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公开(公告)号：US20130128472A1
公开(公告)日：2013-05-23
申请号：US13484823
申请日：2012-05-31
Applicant: Kyung Don MUN , Kil Yong Yun
Inventor： Kyung Don MUN , Kil Yong Yun
CPC classification number: H05K3/007 , H05K1/116 , H05K3/0097 , H05K3/045 , H05K3/4652 , H05K2201/0376 , H05K2201/09509 , H05K2201/09545 , Y10T29/49126
Abstract: The present invention discloses a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: forming a first circuit pattern on a metal layer formed on one surface of a base substrate; forming a second circuit pattern after laminating a first insulating layer in which the first circuit pattern is embedded; sequentially laminating a second insulating layer and a preliminary third circuit pattern on the second circuit pattern; separating the base substrate and forming a hole in the separated substrate; and forming a third circuit pattern, a landless first fill-plating layer, and a second fill-plating layer by performing fill-plating on the entire surface of the substrate in which the hole is formed, forming an insulating film layer on the other surface of the substrate, and performing an etching process on one surface and the other surface of the substrate.
Abstract translation: 本发明公开了一种印刷电路板及其制造方法。 印刷电路板的制造方法包括：在形成在基底基板的一个表面上的金属层上形成第一电路图案; 在层叠嵌有第一电路图案的第一绝缘层之后形成第二电路图案; 在第二电路图案上依次层叠第二绝缘层和初步第三电路图案; 分离基底并在分离的基底中形成孔; 以及通过在其上形成孔的基板的整个表面上进行填充镀敷形成第三电路图案，无地形第一填充镀层和第二填充镀层，在另一表面上形成绝缘膜层 并且在基板的一个表面和另一个表面上进行蚀刻处理。
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