发明申请
- 专利标题： Processing method and processing system
- 专利标题（中）： 处理方法和处理系统
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申请号： US12588395申请日： 2009-10-14
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公开(公告)号： US20100133231A1公开(公告)日： 2010-06-03
- 发明人: Tsuyoshi Ohno , Toshihiko Kikuchi , Machi Moriya , Yoshitaka Saita
- 申请人： Tsuyoshi Ohno , Toshihiko Kikuchi , Machi Moriya , Yoshitaka Saita
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 优先权： JP2003-177237 20030620; JP2004-168649 20040607
- 主分类号： C23F1/00
- IPC分类号： C23F1/00
摘要：
The present invention is a processing method including a processing step of performing predetermined processing for a workpiece; an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and a surface structure evaluation step of evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by the unnecessary portion removal step.
公开/授权文献
- US08778205B2 Processing method and processing system 公开/授权日：2014-07-15