Invention Application
- Patent Title: LASER MACHINING SYSTEM AND METHOD
- Patent Title (中): 激光加工系统和方法
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Application No.: US12328349Application Date: 2008-12-04
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Publication No.: US20100140236A1Publication Date: 2010-06-10
- Inventor: Guoshang Cai , Kevin George Harding , Magdi Naim Azer , Yong Liu , Sudhir Kumar Tewari , Robert William Tait , Xiaobin Chen , Yanmin Li , Huan Qi , David Henry Abbott
- Applicant: Guoshang Cai , Kevin George Harding , Magdi Naim Azer , Yong Liu , Sudhir Kumar Tewari , Robert William Tait , Xiaobin Chen , Yanmin Li , Huan Qi , David Henry Abbott
- Applicant Address: US NY SCHENECTADY
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY SCHENECTADY
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A laser machining system comprises a laser configured to generate a laser output for forming a molten pool on a substrate, a nozzle configured to supply a growth material to the molten pool for depositing the material on the substrate, and an optical unit configured to capture a plurality of grayscale images comprising temperature data during the laser deposition process, wherein the grayscale images correspond to respective ones of a plurality of radiation beams with different desired wavelengths. Further, the laser machining system comprises an image-processing unit configured to process the grayscale images to retrieve the temperature data according to linear relationships between temperatures in the laser deposition process and the corresponding grayscales of the respective images. A laser machining method is also presented.
Public/Granted literature
- US2559283A Multiple purpose radial saw Public/Granted day:1951-07-03
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