A semiconductor manufacturing apparatus includes a load port supporting a FOUP holding a plurality of wafers, a process module performing a semiconductor manufacturing process on the plurality of wafers, an equipment front end module disposed between the load port and the process module, providing a clean area, and including an opener for opening and closing a door of the FOUP, a transfer module sequentially transferring the plurality of wafers between the FOUP and the process module, and a purge module spraying a purge gas toward the plurality of wafers in the FOUP when the door is open to connect the equipment front end module and the FOUP, so as to make gases released from the plurality of wafers be recovered into the equipment front end module.