发明申请
- 专利标题： Three-dimensional Wiping Substrate And Method Therefor
- 专利标题（中）： 三维擦拭基板及其方法
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申请号： US12336078申请日： 2008-12-16
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公开(公告)号： US20100147203A1公开(公告)日： 2010-06-17
- 发明人: John Gavin MacDonald , Jaeho Kim , WanDuk Lee , Jin Heo , CholWon Koh , SangSoo Lee
- 申请人： John Gavin MacDonald , Jaeho Kim , WanDuk Lee , Jin Heo , CholWon Koh , SangSoo Lee
- 主分类号： D05B3/00
- IPC分类号： D05B3/00
摘要：
A planar substrate has a moisture activated shrinking filament applied thereon. When wetted, the shrinking filament shrinks and causes the planar substrate to gather and pucker. The planar substrate with the filament thereon may be compressed into a compact shape when in a dry state.
公开/授权文献
- US08225729B2 Three-dimensional wiping substrate and method therefor 公开/授权日：2012-07-24