发明申请
- 专利标题： WINDOW BALL GRID ARRAY SUBSTRATE AND ITS PACKAGE STRUCTURE
- 专利标题（中）： WINDOW球形阵列基板及其包装结构
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申请号： US12333746申请日： 2008-12-12
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公开(公告)号： US20100147565A1公开(公告)日： 2010-06-17
- 发明人: Wen-Jeng Fan , Ching-Wei Hung , Tsai-Chuan Yu
- 申请人： Wen-Jeng Fan , Ching-Wei Hung , Tsai-Chuan Yu
- 主分类号： H01R12/36
- IPC分类号： H01R12/36
摘要：
A window ball grid array substrate and its package structure includes a package substrate with a long slot arranged thereon, wherein the improvement is characterized by the long slot penetrating an end of the package substrate making the package substrate appear to be U-shaped.
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