Invention Application
- Patent Title: METHOD FOR ELECTROPLATING A SUBSTRATE
- Patent Title (中): 电镀基材的方法
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Application No.: US12703723Application Date: 2010-02-10
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Publication No.: US20100147697A1Publication Date: 2010-06-17
- Inventor: Lex Kosowsky , Robert Fleming
- Applicant: Lex Kosowsky , Robert Fleming
- Main IPC: C25D9/00
- IPC: C25D9/00

Abstract:
One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.
Public/Granted literature
- US07968010B2 Method for electroplating a substrate Public/Granted day:2011-06-28
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