Invention Application
US20100147697A1 METHOD FOR ELECTROPLATING A SUBSTRATE 失效
电镀基材的方法

METHOD FOR ELECTROPLATING A SUBSTRATE
Abstract:
One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.
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