发明申请
US20100155033A1 THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS
审中-公开
使用微热管对电子元件进行热管理的热管理系统
- 专利标题： THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS
- 专利标题（中）： 使用微热管对电子元件进行热管理的热管理系统
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申请号： US12607619申请日： 2009-10-28
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公开(公告)号： US20100155033A1公开(公告)日： 2010-06-24
- 发明人: Woodrow W. Holley , Jerome P. Fanucci
- 申请人： Woodrow W. Holley , Jerome P. Fanucci
- 申请人地址： US MA Woburn
- 专利权人： KAZAK COMPOSITES, INC.
- 当前专利权人： KAZAK COMPOSITES, INC.
- 当前专利权人地址： US MA Woburn
- 主分类号： F28D15/02
- IPC分类号： F28D15/02 ; B21D53/02
摘要：
A thermal management system includes a base element and a heat producing element disposed for heat transfer from the heat producing element to the base element. An adherent zone includes an adherent element in physical attachment between the heat producing element and the base element. A heat transfer zone, separate from the adherent zone, includes a heat pipe between the heat producing element and the base element. The heat pipe includes a circulatory flow path between an evaporator section and a condenser section, and a working fluid on the circulatory flow path.
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