THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS
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    发明申请
    THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS 审中-公开
    使用微热管对电子元件进行热管理的热管理系统

    公开(公告)号:US20100155033A1

    公开(公告)日:2010-06-24

    申请号:US12607619

    申请日:2009-10-28

    IPC分类号: F28D15/02 B21D53/02

    摘要: A thermal management system includes a base element and a heat producing element disposed for heat transfer from the heat producing element to the base element. An adherent zone includes an adherent element in physical attachment between the heat producing element and the base element. A heat transfer zone, separate from the adherent zone, includes a heat pipe between the heat producing element and the base element. The heat pipe includes a circulatory flow path between an evaporator section and a condenser section, and a working fluid on the circulatory flow path.

    摘要翻译: 热管理系统包括基座元件和设置用于从发热元件到基座元件的热传递的发热元件。 粘附区域包括在发热元件和基底元件之间物理连接的粘附元件。 与粘附区分开的传热区包括在发热元件和基底元件之间的热管。 热管包括在蒸发器部分和冷凝器部分之间的循环流动路径以及循环流动路径上的工作流体。