发明申请
- 专利标题： MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- 专利标题（中）： 多层印刷电路板及其制造方法
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申请号： US12611231申请日： 2009-11-03
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公开(公告)号： US20100159647A1公开(公告)日： 2010-06-24
- 发明人: Sotaro ITO , Michimasa Takahashi , Yukinobu Mikado
- 申请人： Sotaro ITO , Michimasa Takahashi , Yukinobu Mikado
- 申请人地址： JP Ogaki-shi
- 专利权人： IBIDEN CO., LTD.
- 当前专利权人： IBIDEN CO., LTD.
- 当前专利权人地址： JP Ogaki-shi
- 优先权： JP2005-364088 20051216
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein a electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.
公开/授权文献
- US07929313B2 Method of manufacturing multilayer printed circuit board 公开/授权日：2011-04-19
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