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    Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
    1.
    发明授权
    Multilayer printed wiring board and method for manufacturing multilayer printed wiring board 有权
    多层印刷线路板及其制造方法

    公开(公告)号：US09332657B2

    公开(公告)日：2016-05-03

    申请号：US13629961

    申请日：2012-09-28

    申请人： Toshiki Furutani ,  Yukinobu Mikado ,  Mitsuhiro Tomikawa ,  Tomoya Terakura

    发明人： Toshiki Furutani ,  Yukinobu Mikado ,  Mitsuhiro Tomikawa ,  Tomoya Terakura

    IPC分类号： H05K1/16 ,  H05K1/18 ,  H05K3/44 ,  H05K3/46

    CPC分类号： H05K3/445 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/10015 ,  Y10T29/4913

    摘要： A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures.

    摘要翻译： 一种多层印刷布线板的制造方法，其特征在于，具备金属部件和连接金属部件的连接部的金属层，分别形成具有电子部件的层叠多层结构体和金属部件部，在连接部中形成切断后的贯通孔 分别切割金属层的连接部分，并在叠层多层结构上形成层间绝缘层，使层压多层结构夹在层间绝缘层之间。 层间绝缘层的形成包括用层叠的多层结构中的一个或多个层间绝缘层衍生的树脂填充切割的通孔。

    Wiring board and method for manufacturing the same
    2.
    发明授权
    Wiring board and method for manufacturing the same 有权
    接线板及其制造方法

    公开(公告)号：US08829357B2

    公开(公告)日：2014-09-09

    申请号：US13307480

    申请日：2011-11-30

    申请人： Yukinobu Mikado ,  Shunsuke Sakai ,  Mitsuhiro Tomikawa

    发明人： Yukinobu Mikado ,  Shunsuke Sakai ,  Mitsuhiro Tomikawa

    IPC分类号： H05K1/16 ,  H05K3/00 ,  H05K1/18 ,  H05K3/46 ,  H05K3/42

    CPC分类号： H05K1/185 ,  H05K3/0038 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/4913

    摘要： A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface.

    摘要翻译： 布线基板包括具有开口部分和与开口部分相邻的通孔的核心基板，位于开口部分中的电容器，以及形成在芯基板的通孔中的通孔导体， 通孔。 芯基板具有在第一表面的相对侧的第一表面和第二表面，芯基板的开口部分从第一表面穿透到第二表面，通孔导体具有第一导电部分和第二导电部分 导电部分连接到芯基板中的第一导电部分，通孔导体的第一导电部分从第一表面朝向第二表面变窄，并且通孔导体的第二导电部分从第二导体部分变窄 表面朝向第一表面。

    MULTILAYER PRINTED WIRING BOARD
    5.
    发明申请
    MULTILAYER PRINTED WIRING BOARD 有权
    多层印刷接线板

    公开(公告)号：US20120005889A1

    公开(公告)日：2012-01-12

    申请号：US13243112

    申请日：2011-09-23

    申请人： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

    发明人： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

    IPC分类号： H05K3/00

    CPC分类号： H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00

    摘要： A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 μm or less in thickness.

    摘要翻译： 一种制造多层印刷线路板的方法，包括形成包括第一和第二积累部分的多层印刷线路板结构，所述第一累积部分包括绝缘层，导体层和通过绝缘层将导体层电连接的第一通孔，使得第一 分别在绝缘层中形成通孔，第二累积部分包括绝缘层，导体层和第二通孔，其通过绝缘层电连接导体层，使得第一通孔朝向第二通孔逐渐变细，第二通孔为 朝向第一通孔逐渐变细。 通孔由层叠各积层部的绝缘层之后形成的电镀开口形成，积层部的各绝缘层的厚度为100μm以下。

    Flex-rigid wiring board and manufacturing method thereof
    6.
    发明授权
    Flex-rigid wiring board and manufacturing method thereof 有权
    挠性刚性布线板及其制造方法

    公开(公告)号：US08093502B2

    公开(公告)日：2012-01-10

    申请号：US11629099

    申请日：2005-06-09

    申请人： Yukinobu Mikado ,  Katsumi Sagisaka ,  Katsuo Kawaguchi ,  Tetsuya Muraki

    发明人： Yukinobu Mikado ,  Katsumi Sagisaka ,  Katsuo Kawaguchi ,  Tetsuya Muraki

    IPC分类号： H05K1/03

    CPC分类号： H05K1/0281 ,  H05K1/0366 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4691 ,  H05K2201/09263 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/2009 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/31663

    摘要： A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent. Thus, the proposed flex-rigid printed wiring board is excellent in connection reliability, permitting to prevent the base material from being easily deformed near the bending portion, conductor circuit from being broken and the flexible substrate from being waved. The similar effect can also be attained with the wiring patterns of the conductor circuit on the flexible substrate being formed wide or curved in the width direction at the bending portion.

    摘要翻译： 提出了一种柔性刚性印刷线路板，其包括由绝缘基材和设置在绝缘基材上的导体电路形成的刚性基板，以及由绝缘基材形成的可弯曲柔性基板，设置在绝缘基底上的导体电路 材料和盖子覆盖导体电路，刚性和柔性基板彼此连接。 作为柔性基板的绝缘基材，采用通过用树脂浸渍玻璃布并干燥而形成的可弯曲基材。 导体电路形成在柔性基板的一侧，而虚拟图案形成在柔性基板弯曲部分附近的另一侧。 因此，所提出的柔性刚性印刷电路板的连接可靠性优异，可以防止基体在弯曲部附近容易变形，导体电路不被破坏，柔性基板不会挥动。 柔性基板上的导体电路的布线图案也可以在弯曲部分沿宽度方向形成宽或弯曲形成同样的效果。