发明申请
- 专利标题： VACUUM PROCESSING APPARATUS
- 专利标题（中）： 真空加工设备
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申请号： US12369767申请日： 2009-02-12
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公开(公告)号： US20100163181A1公开(公告)日： 2010-07-01
- 发明人: Hiroyuki KOBAYASHI , Kenji MAEDA , Masaru IZAWA , Makoto NAWATA , Shingo KIMURA
- 申请人： Hiroyuki KOBAYASHI , Kenji MAEDA , Masaru IZAWA , Makoto NAWATA , Shingo KIMURA
- 专利权人： Hitachi High-Technologies Corporation
- 当前专利权人： Hitachi High-Technologies Corporation
- 优先权： JP2008-332887 20081226
- 主分类号： H01L21/3065
- IPC分类号： H01L21/3065 ; B05C11/00
摘要：
There is provided a vacuum processing apparatus including a valve whose opening degree can be set to any size and a control computer which automatically controls a depressurizing rate. The vacuum processing apparatus can reduce the number of foreign particles adhered to a sample to be processed in the lock chamber and can improve the throughput at the same time.
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