发明申请
US20100165583A1 Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module
审中-公开
PCB制造方法，显示模块及制造显示模块的方法
- 专利标题： Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module
- 专利标题（中）： PCB制造方法，显示模块及制造显示模块的方法
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申请号： US12434756申请日： 2009-05-04
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公开(公告)号： US20100165583A1公开(公告)日： 2010-07-01
- 发明人: Wen-Hsin Lin , Ching-Kun Lai , Chien-Hung Chen
- 申请人： Wen-Hsin Lin , Ching-Kun Lai , Chien-Hung Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： AU OPTRONICS CORPORATION
- 当前专利权人： AU OPTRONICS CORPORATION
- 当前专利权人地址： TW Hsin-Chu
- 优先权： TW97151471 20081230
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H05K3/30 ; H01J9/00
摘要：
In the specification and drawing a display module is disclosed. The display module comprises a backboard, a display component and a printed circuit board with at least one locating pin formed thereon. The backboard has at least one locating hole. The display component is disposed on the backboard. The at least one the locating pin is inserted in the locating hole. Moreover, a method for manufacturing the printed circuit board and a method for fabricating the display module are also disclosed in the specification and drawing.
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