发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
- 专利标题（中）： 集成电路封装封装堆栈系统
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申请号： US12730171申请日： 2010-03-23
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公开(公告)号： US20100176497A1公开(公告)日： 2010-07-15
- 发明人: Dioscoro A. Merilo , Heap Hoe Kuan , You Yang Ong , Seng Guan Chow , Ma. Shirley Asoy
- 申请人： Dioscoro A. Merilo , Heap Hoe Kuan , You Yang Ong , Seng Guan Chow , Ma. Shirley Asoy
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
公开/授权文献
- US07868434B2 Integrated circuit package-on-package stacking system 公开/授权日：2011-01-11
信息查询
IPC分类:
