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公开(公告)号：US07868434B2
公开(公告)日：2011-01-11
申请号：US12730171
申请日：2010-03-23
IPC分类号： H01L23/495
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
摘要翻译： 一种集成电路封装堆叠堆叠系统，包括引线框架插入器，其包括：具有引线的引线框架; 在引线的一部分上仅用于支撑引线的模制基座; 并且引线框架插入器从引线框架分离，其中引线被弯曲以支撑堆叠高度。
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公开(公告)号：US07535086B2
公开(公告)日：2009-05-19
申请号：US11462320
申请日：2006-08-03
IPC分类号： H01L23/495 , H01L23/48 , H01L21/00
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and singulating the leadframe interposer from the leadframe.
摘要翻译： 提供了一种集成电路封装堆叠堆叠系统，包括：形成引线框架中介层，包括：形成引线框架; 在引线框架上形成模制基座; 并从引线框架中分离引线框架插入器。
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公开(公告)号：US20100176497A1
公开(公告)日：2010-07-15
申请号：US12730171
申请日：2010-03-23
IPC分类号： H01L23/495
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
摘要翻译： 一种集成电路封装堆叠堆叠系统，包括引线框架插入器，其包括：具有引线的引线框架; 在引线的一部分上仅用于支撑引线的模制基座; 并且引线框架插入器从引线框架分离，其中引线被弯曲以支撑堆叠高度。
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4.发明授权Integrated circuit package-on-package stacking system and method of manufacture thereof 有权集成电路封装堆叠堆叠系统及其制造方法公开(公告)号：US07718472B2
公开(公告)日：2010-05-18
申请号：US12409491
申请日：2009-03-24
IPC分类号： H01L21/00 , H01L23/495 , H01L23/48
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.
摘要翻译： 一种集成电路封装堆叠堆叠方法，包括形成引线框架插入器，包括：形成具有引线的引线框架; 形成仅支撑引线的模制基座; 并从引线框架中分离引线框架插入器。
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公开(公告)号：US20090179312A1
公开(公告)日：2009-07-16
申请号：US12409491
申请日：2009-03-24
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.
摘要翻译： 一种集成电路封装堆叠堆叠方法，包括形成引线框架插入器，包括：形成具有引线的引线框架; 形成仅支撑引线的模制基座; 并从引线框架中分离引线框架插入器。
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公开(公告)号：US20080029858A1
公开(公告)日：2008-02-07
申请号：US11462320
申请日：2006-08-03
IPC分类号： H01L23/495
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49833 , H01L23/49861 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and singulating the leadframe interposer from the leadframe.
摘要翻译： 提供了一种集成电路封装堆叠堆叠系统，包括：形成引线框架中介层，包括：形成引线框架; 在引线框架上形成模制基座; 并从引线框架中分离引线框架插入器。
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公开(公告)号：US08546929B2
公开(公告)日：2013-10-01
申请号：US11379336
申请日：2006-04-19
申请人： You Yang Ong , Dioscoro A. Merilo , Seng Guan Chow
发明人： You Yang Ong , Dioscoro A. Merilo , Seng Guan Chow
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L23/5385 , H01L24/19 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An embedded integrated circuit package-on-package system is provided forming a first integrated circuit package system, forming a second integrated circuit package system, and mounting the second integrated circuit package system over the first integrated circuit package system with the first integrated circuit package system, the second integrated circuit package system, or a combination thereof being an embedded integrated circuit package system or an embedded stacked integrated circuit package system.
摘要翻译： 提供一种嵌入式集成电路封装封装系统，其形成第一集成电路封装系统，形成第二集成电路封装系统，以及将所述第二集成电路封装系统安装在所述第一集成电路封装系统上与所述第一集成电路封装系统 ，第二集成电路封装系统或其组合是嵌入式集成电路封装系统或嵌入式堆叠集成电路封装系统。
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8.发明授权公开(公告)号：US08067832B2
公开(公告)日：2011-11-29
申请号：US12964638
申请日：2010-12-09
申请人： You Yang Ong , Dioscoro A. Merilo , Seng Guan Chow
发明人： You Yang Ong , Dioscoro A. Merilo , Seng Guan Chow
IPC分类号： H01L23/04
CPC分类号： H01L23/3128 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L25/16 , H01L2223/54433 , H01L2223/54473 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/32145 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/97 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/18162 , H01L2924/19105 , H01L2924/3025 , H05K1/0206 , H05K1/185 , H05K3/4602
摘要： A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by the bumps; forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern; forming a channel in the substrate forming encapsulation; and applying a conductive material in the channel.
摘要翻译： 嵌入式集成电路封装系统的制造方法包括：在第一结构上形成第一导电图案; 通过所述凸块直接在所述第一导电图案上连接具有第一有源侧上的凸块的第一集成电路裸片; 形成衬底形成封装以覆盖第一集成电路管芯和第一导电图案; 在衬底形成封装中形成通道; 以及在所述通道中施加导电材料。
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9.发明申请公开(公告)号：US20110079899A1
公开(公告)日：2011-04-07
申请号：US12964638
申请日：2010-12-09
申请人： You Yang Ong , Dioscoro A. Merilo , Seng Guan Chow
发明人： You Yang Ong , Dioscoro A. Merilo , Seng Guan Chow
CPC分类号： H01L23/3128 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L25/16 , H01L2223/54433 , H01L2223/54473 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/32145 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/97 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/18162 , H01L2924/19105 , H01L2924/3025 , H05K1/0206 , H05K1/185 , H05K3/4602
摘要： A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by the bumps; forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern; forming a channel in the substrate forming encapsulation; and applying a conductive material in the channel.
摘要翻译： 嵌入式集成电路封装系统的制造方法包括：在第一结构上形成第一导电图案; 通过所述凸块直接在所述第一导电图案上连接具有第一有源侧上的凸块的第一集成电路裸片; 形成衬底形成封装以覆盖第一集成电路管芯和第一导电图案; 在衬底形成封装中形成通道; 以及在所述通道中施加导电材料。
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公开(公告)号：US07859098B2
公开(公告)日：2010-12-28
申请号：US11379332
申请日：2006-04-19
申请人： You Yang Ong , Dioscoro A. Merilo , Seng Guan Chow
发明人： You Yang Ong , Dioscoro A. Merilo , Seng Guan Chow
IPC分类号： H01L23/04
CPC分类号： H01L23/3128 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L25/16 , H01L2223/54433 , H01L2223/54473 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/32145 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/97 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/18162 , H01L2924/19105 , H01L2924/3025 , H05K1/0206 , H05K1/185 , H05K3/4602
摘要： An embedded integrated circuit package system is provided forming a first conductive pattern on a first structure, connecting a first integrated circuit die on the first conductive pattern, forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern, forming a channel in the substrate forming encapsulation, and applying a conductive material in the channel.
摘要翻译： 提供了一种在第一结构上形成第一导电图案的嵌入式集成电路封装系统，将第一集成电路管芯连接在第一导电图案上，形成衬底形成封装以覆盖第一集成电路管芯和第一导电图案，形成 在衬底形成封装中的通道，以及在沟道中施加导电材料。
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