发明申请
- 专利标题: RFID PACKAGING AND ATTACHMENT METHODS AND DEVICES
- 专利标题(中): RFID包装和附件方法和设备
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申请号: US12351590申请日: 2009-01-09
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公开(公告)号: US20100176971A1公开(公告)日: 2010-07-15
- 发明人: Swagata R. Banerjee , Jacob D. Chatterton , Justin M. Johnson , Michael C. Molinet , Robert A. Sainati
- 申请人: Swagata R. Banerjee , Jacob D. Chatterton , Justin M. Johnson , Michael C. Molinet , Robert A. Sainati
- 专利权人: 3M INNOVATIVE PROPERTIES COMPANY
- 当前专利权人: 3M INNOVATIVE PROPERTIES COMPANY
- 主分类号: G08G1/00
- IPC分类号: G08G1/00 ; H04Q5/22
摘要:
One exemplary electrically conductive, RFID-enabled signage includes (1) an electrically conductive article including an opening and (2) an assembled device that is coupled to the electrically conductive article to provide RFID functionality to the electrically conductive article. One exemplary kit includes (1) an RFID IC arrangement including conductive leads adjacent to an integrated circuit; (2) an insert attached to the RFID IC arrangement; and (3) an attachment device capable of attaching the RFID IC arrangement-insert combination to an electrically conductive signage such that the RFID IC arrangement is positioned to span at least a portion of an opening in the signage and to electrically couple the integrated circuit to the electrically conductive signage. One exemplary method involves providing an assembled device including and RFID IC arrangement and an insert and coupling the assembled device with an electrically conductive signage.
公开/授权文献
- US07922094B2 RFID packaging and attachment methods and devices 公开/授权日:2011-04-12
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