发明申请
US20100179283A1 SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT
失效
含硅化合物,可固化组合物和固化产品
- 专利标题: SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT
- 专利标题(中): 含硅化合物,可固化组合物和固化产品
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申请号: US12596933申请日: 2008-04-21
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公开(公告)号: US20100179283A1公开(公告)日: 2010-07-15
- 发明人: Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
- 申请人: Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
- 申请人地址: JP Tokyo
- 专利权人: ADEKA CORPORATION
- 当前专利权人: ADEKA CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-112738 20070423
- 国际申请: PCT/JP2008/057665 WO 20080421
- 主分类号: C08L83/00
- IPC分类号: C08L83/00 ; C07F7/02 ; C08G77/12
摘要:
A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra—Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y═C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.
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