Invention Application
US20100186892A1 ELECTROSTATICALLY APPLYING A LABEL TO A MOLD CAVITY 审中-公开
静电地将标签应用于模具

  • Patent Title: ELECTROSTATICALLY APPLYING A LABEL TO A MOLD CAVITY
  • Patent Title (中): 静电地将标签应用于模具
  • Application No.: US12451445
    Application Date: 2008-05-14
  • Publication No.: US20100186892A1
    Publication Date: 2010-07-29
  • Inventor: Mark Blitshteyn
  • Applicant: Mark Blitshteyn
  • International Application: PCT/US08/06145 WO 20080514
  • Main IPC: B29C65/00
  • IPC: B29C65/00 B29C65/14
ELECTROSTATICALLY APPLYING A LABEL TO A MOLD CAVITY
Abstract:
The disclosure describes the use of electrostatics to in-mold labeling wherein a label is secured to a mandrel with an axis-defining body, a first end, a distal end, a set of ionizing electrodes disposed about the body, near the distal end, and in a plane perpendicular to the axis. When the mandrel is positioned in a mold cavity, the label is released and a varying voltage applied to the electrodes to form a substantially uniform and ring-like source of ionizing current. The ionizing current progressively pins the label against the die as the mandrel is withdrawn from the die until substantially the entire label is pinned. The ionizing current may then be ended and the mandrel removed so that an article may then be formed into the label.
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