发明申请
US20100187681A1 Silicon Substrate Having Through Vias and Package Having the Same
有权
具有透明度的硅基板和具有相同的封装
- 专利标题： Silicon Substrate Having Through Vias and Package Having the Same
- 专利标题（中）： 具有透明度的硅基板和具有相同的封装
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申请号： US12691478申请日： 2010-01-21
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公开(公告)号： US20100187681A1公开(公告)日： 2010-07-29
- 发明人: Kuo-Hua Chen , Kuo-Pin Yang
- 申请人： Kuo-Hua Chen , Kuo-Pin Yang
- 优先权： TW098103034 20090123
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/48
摘要：
The present invention relates to a silicon substrate having through vias and a package having the same. The silicon substrate includes a substrate body, a plurality of through vias and at least one heat dissipating area. The substrate body has a surface, and the material of the substrate body is silicon. The through vias penetrate the substrate body, and each of the through vias has a conductive material therein. The heat dissipating area is disposed on the surface of the substrate body and covers at least two through vias. The heat dissipating area is made of metal, and the through vias inside the heat dissipating area have same electrical potential. Thus, the heat in the through vias is transmitted to the heat dissipating area, and since the area of the heat dissipating area is large, the silicon substrate has good heat dissipation efficiency.
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