公开(公告)号：US08188593B2

公开(公告)日：2012-05-29

申请号：US12691478

申请日：2010-01-21

Applicant: Kuo-Hua Chen ,  Kuo-Pin Yang

Inventor： Kuo-Hua Chen ,  Kuo-Pin Yang

IPC: H01L23/34 ,  H01L23/48

CPC classification number: H01L23/49827 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49816 ,  H01L24/16 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

Abstract: The present invention relates to a silicon substrate having through vias and a package having the same. The silicon substrate includes a substrate body, a plurality of through vias and at least one heat dissipating area. The substrate body has a surface, and the material of the substrate body is silicon. The through vias penetrate the substrate body, and each of the through vias has a conductive material therein. The heat dissipating area is disposed on the surface of the substrate body and covers at least two through vias. The heat dissipating area is made of metal, and the through vias inside the heat dissipating area have same electrical potential. Thus, the heat in the through vias is transmitted to the heat dissipating area, and since the area of the heat dissipating area is large, the silicon substrate has good heat dissipation efficiency.

Abstract translation: 本发明涉及具有通孔的硅衬底和具有该通孔的封装。 硅衬底包括衬底主体，多个通孔和至少一个散热区域。 基板主体具有表面，并且基板主体的材料是硅。 通孔穿透基板主体，并且通孔中的每一个在其中具有导电材料。 散热区域设置在基板主体的表面上并且覆盖至少两个通孔。 散热区由金属制成，散热区内的通孔具有相同的电位。 因此，通孔中的热量传递到散热区域，由于散热面积大，所以硅基板具有良好的散热效率。

公开(公告)号：US20110123734A1

公开(公告)日：2011-05-26

申请号：US12857547

申请日：2010-08-16

Applicant: FRANK YANG ,  Ming-Chun Ho ,  Chang-Jen Huang ,  Kuo-Hua Chen ,  Shih-Chien Hsiao ,  Cheng-Chieh Kao ,  Chih-Che Kuo ,  Kuo-Chih Yang ,  Chuei-Chuan Wang

Inventor： FRANK YANG ,  Ming-Chun Ho ,  Chang-Jen Huang ,  Kuo-Hua Chen ,  Shih-Chien Hsiao ,  Cheng-Chieh Kao ,  Chih-Che Kuo ,  Kuo-Chih Yang ,  Chuei-Chuan Wang

IPC: B32B3/08 ,  E06B3/00

CPC classification number: B32B17/06 ,  E06B3/677

Abstract: A vacuum glass structure comprising two glass substrates maintained at an substantially constant interval by a glass frit paste sealingly adhering to the peripheries thereof, forming a hermetically sealed vacuum room. A receiving gap is formed at the periphery of the glass substrate. The internal surface of the glass structure further includes an air chamber and a glass tube groove for receiving a pumping tube. The pumping tube can be placed inside the receiving gap with the internal end of the pumping tube extending from the receiving gap through the glass tube groove into the air chamber. The external end of the pumping tube constitutes a hermetic seal retained within the geometric boundary of the receiving gap. The air chamber structure may improve air transferring efficiency and prevents problems such as blockage in the pumping tube, thus enabling an increase in production yield.

Abstract translation: 一种真空玻璃结构，包括通过密封地附着在其周边上的玻璃料糊保持基本上恒定间隔的两个玻璃基板，形成气密密封的真空室。 在玻璃基板的周围形成有接收间隙。 玻璃结构的内表面还包括用于接收泵管的空气室和玻璃管槽。 泵送管可以放置在接收间隙内，泵管的内端从容纳间隙通过玻璃管槽延伸到空气室中。 泵管的外端构成保持在接收间隙的几何边界内的气密密封。 空气室结构可以提高空气传输效率，并且防止泵送管中的堵塞等问题，从而能够提高产量。

公开(公告)号：US07812433B2

公开(公告)日：2010-10-12

申请号：US12078076

申请日：2008-03-27

Applicant: Mi-Cheng Cheng ,  Kuo-Hua Chen

Inventor： Mi-Cheng Cheng ,  Kuo-Hua Chen

IPC: H01L23/02

CPC classification number: B81B7/0067 ,  B81B7/0093 ,  B81B2201/042 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.

Abstract translation: 提供封装结构和使用其的电子器件。 封装结构包括芯片模块和盖。 覆盖的芯片模块用于接收第一个信号。 芯片模块包括基板，散热器和第一芯片。 基板具有第一表面，第二表面和开口。 第一表面与第二表面相对。 开口穿过第一表面和第二表面。 散热器设置在基板的第一表面上并覆盖开口。 第一芯片设置在散热器上并位于开口内。 第一芯片的底面平坦地接触散热器。 盖子有一个窗口元素。 第一个信号通过窗口元件与芯片模块接触。

公开(公告)号：US20100165211A1

公开(公告)日：2010-07-01

申请号：US12648935

申请日：2009-12-29

Applicant: Pi-Chang Chiu ,  Kuo-Hua Chen

Inventor： Pi-Chang Chiu ,  Kuo-Hua Chen

IPC: H04N5/63

CPC classification number: H04N21/4436 ,  H04N21/418 ,  Y10T307/658 ,  Y10T307/675 ,  Y10T307/696 ,  Y10T307/729

Abstract: An electronic card connector is used to connect an electronic card to an electronic device, such as a level-shifting device. The electronic card connector includes an insert slot unit and a switch unit. The insert slot unit is adapted for insertion of the electronic card and is provided with a power signal terminal for providing electric power to the electronic card that is inserted into the insert slot unit. The 10 switch unit is disposed in the insert slot unit, is operable to establish electrical connection between the power signal terminal and a first power source when the electronic card inserted into the insert slot unit does not actuate the switch unit, and is further operable to establish electrical connection between the power signal terminal and a second power source when the electronic card inserted into the insert slot unit actuates the switch unit.

公开(公告)号：US20080290489A1

公开(公告)日：2008-11-27

申请号：US12078076

申请日：2008-03-27

Applicant: Mi-Cheng Cheng ,  Kuo-Hua Chen

Inventor： Mi-Cheng Cheng ,  Kuo-Hua Chen

IPC: H01L23/36

CPC classification number: B81B7/0067 ,  B81B7/0093 ,  B81B2201/042 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.

Abstract translation: 提供封装结构和使用其的电子器件。 封装结构包括芯片模块和盖。 覆盖的芯片模块用于接收第一个信号。 芯片模块包括基板，散热器和第一芯片。 基板具有第一表面，第二表面和开口。 第一表面与第二表面相对。 开口穿过第一表面和第二表面。 散热器设置在基板的第一表面上并覆盖开口。 第一芯片设置在散热器上并位于开口内。 第一芯片的底面平坦地接触散热器。 盖子有一个窗口元素。 第一个信号通过窗口元件与芯片模块接触。

公开(公告)号：US20050285245A1

公开(公告)日：2005-12-29

申请号：US11135355

申请日：2005-05-24

Applicant: Jen-Chieh Kao ,  Kuo-Hua Chen

Inventor： Jen-Chieh Kao ,  Kuo-Hua Chen

IPC: B29C45/02 ,  B29C45/14 ,  B29C45/27 ,  H01L21/56 ,  H01L23/053 ,  H01L23/62 ,  H01L27/146 ,  H01L31/0203

CPC classification number: B29C45/14655 ,  B29C45/02 ,  B29C45/27 ,  H01L21/561 ,  H01L21/565 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15313 ,  H01L2924/00014

Abstract: A substrate strip for a transparent package has a top surface, a bottom surface and an injection region through the top and bottom surface. The top surface includes a plurality of package regions and a plurality of runner regions. The injection region is disposed between the package regions and is coupled to the runner regions. The injection region has a sidewall with a releasing layer for preventing the residual of clear compound from remaining at the injection region of the substrate strip.

Abstract translation: 用于透明封装的衬底条具有通过顶表面和底表面的顶表面，底表面和注入区域。 顶表面包括多个包装区域和多个流道区域。 注射区域设置在包装区域之间并且连接到流道区域。 注入区域具有带有释放层的侧壁，用于防止残留的透明化合物残留在衬底条的注入区域。

公开(公告)号：US06873878B2

公开(公告)日：2005-03-29

申请号：US10156335

申请日：2002-05-24

Applicant: Kuei-Yi Liu ,  Kuo-Hua Chen ,  De-Cheng Weng ,  Long-Fan Lin ,  Chiung-Fang Hsieh

Inventor： Kuei-Yi Liu ,  Kuo-Hua Chen ,  De-Cheng Weng ,  Long-Fan Lin ,  Chiung-Fang Hsieh

IPC: G05B19/418 ,  G06F19/00

CPC classification number: G05B19/41865 ,  G05B2219/32294 ,  Y02P90/20

Abstract: The present invention provides a throughput monitoring and analysis system and method, comprising: a factor-fetching means and a terminal means. Wherein the factor-fetching means fetches a plurality of raw time data of the production factors corresponding to selected operation events during execution of operation events of the complex machine. The terminal means stores the time data and related information of the production factors and displaying the monitoring results according to set required condition and the data and information.

Abstract translation: 本发明提供了一种吞吐量监测和分析系统和方法，包括：因子提取装置和终端装置。 其中，因子提取装置在复杂机器的操作事件的执行期间获取与选择的操作事件相对应的生产要素的多个原始时间数据。 终端装置存储生产要素的时间数据和相关信息，并根据设定的所需条件和数据和信息显示监视结果。

公开(公告)号：US06785702B2

公开(公告)日：2004-08-31

申请号：US09861572

申请日：2001-05-22

Applicant: Oscal T.-C. Chen ,  Kuo-Hua Chen ,  Ruey-Liang Ma

Inventor： Oscal T.-C. Chen ,  Kuo-Hua Chen ,  Ruey-Liang Ma

IPC: G06F752

CPC classification number: G06F7/49942 ,  G06F7/52

Abstract: An energy saving multiplication device and its method is disclosed. The multiplication device includes a dynamic range determination unit, a Booth encoding/decoding unit and a counter array. The dynamic range determination unit determines dynamic ranges of the numerical values to be multiplied together and outputs after processing according to the dynamic-range size relation of the input data. The Booth encoding/decoding unit couples to the dynamic range determination unit. The counter array couples to the Booth encoding/decoding unit for accumulating the partial products to obtain the products of the input data.

Abstract translation: 公开了一种节能倍增装置及其方法。 乘法装置包括动态范围确定单元，布尔编码/解码单元和计数器阵列。 动态范围确定单元确定要相乘的数值的动态范围，并根据输入数据的动态范围大小关系在处理之后输出。 展位编码/解码单元耦合到动态范围确定单元。 计数器阵列耦合到布斯编码/解码单元，用于累积部分乘积以获得输入数据的乘积。

公开(公告)号：US20100149414A1

公开(公告)日：2010-06-17

申请号：US12501682

申请日：2009-07-13

Applicant: Kuo-Hua Chen ,  Yu-Che Tsai

Inventor： Kuo-Hua Chen ,  Yu-Che Tsai

IPC: H04N7/01

CPC classification number: H04N7/0112 ,  H04N7/012 ,  H04N7/0127

Abstract: In the specification and drawing a method for processing video is disclosed. The method comprises the following steps: at least one frame rate of the video is detected, and a refresh rate of a display is adjusted to about 96 Hz when the frame rate is about 24 fps. Moreover, an apparatus for processing video is also disclosed in the specification and drawing.

Abstract translation: 在说明书和绘图中公开了一种用于处理视频的方法。 该方法包括以下步骤：当帧速率为约24fps时，检测到视频的至少一帧速率，并将显示器的刷新率调整到约96Hz。 此外，在说明书和附图中还公开了一种用于处理视频的装置。

公开(公告)号：US20100060668A1

公开(公告)日：2010-03-11

申请号：US12365580

申请日：2009-02-04

Applicant: Kuo-Hua CHEN

Inventor： Kuo-Hua CHEN

IPC: G09G5/10

CPC classification number: G09G3/3406 ,  G09G2320/0626 ,  G09G2360/02

Abstract: A method and device for controlling the backlight brightness of a display element are provided. The display method utilizes horizontal scan frequency and vertical scan frequency of an image to obtain a display mode of the image by referring to a scan-frequency list. When the display mode of the image is a first mode, set the backlight module of the display element to a first brightness, which makes the display element display the image with the first brightness. When the display mode of the image is a second mode, set the backlight module of the display element to a second brightness, which makes the display element display the image with the second brightness, wherein the display element displays the image more brightly with the second brightness than with the first brightness.

Abstract translation: 提供了一种用于控制显示元件的背光亮度的方法和装置。 显示方法利用图像的水平扫描频率和垂直扫描频率，通过参考扫描频率列表来获得图像的显示模式。 当图像的显示模式是第一模式时，将显示元件的背光模块设置为第一亮度，这使得显示元件以第一亮度显示图像。 当图像的显示模式是第二模式时，将显示元件的背光模块设置为第二亮度，这使得显示元件以第二亮度显示图像，其中显示元件与第二亮度更明显地显示图像 亮度比第一亮度亮。