发明申请
US20100190302A1 Electronic Packages with Fine Particle Wetting and Non-Wetting Zones
有权
具有细颗粒润湿和非润湿区域的电子封装
- 专利标题： Electronic Packages with Fine Particle Wetting and Non-Wetting Zones
- 专利标题（中）： 具有细颗粒润湿和非润湿区域的电子封装
-
申请号： US12756380申请日： 2010-04-08
-
公开(公告)号： US20100190302A1公开(公告)日： 2010-07-29
- 发明人: Nirupama Chakrapani , Vijay S. Wakharkar , Chris Matayabas
- 申请人： Nirupama Chakrapani , Vijay S. Wakharkar , Chris Matayabas
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
公开/授权文献
信息查询
IPC分类:
