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公开(公告)号：US08018073B2
公开(公告)日：2011-09-13
申请号：US13050034
申请日：2011-03-17
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
摘要翻译： 通过改变包装表面的粗糙度，可以在集成电路封装中形成扩展或保留区域。 可以通过施加或生长具有小于500纳米尺寸的颗粒来改变表面粗糙度。 亲水性表面可以制成半吸水性，并且疏水表面可以由具有相同通用特征的颗粒制成半吸收。
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公开(公告)号：US20110163445A1
公开(公告)日：2011-07-07
申请号：US13050034
申请日：2011-03-17
IPC分类号： H01L23/28 , H01L23/498
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
摘要翻译： 通过改变包装表面的粗糙度，可以在集成电路封装中形成扩展或保留区域。 可以通过施加或生长具有小于500纳米尺寸的颗粒来改变表面粗糙度。 亲水性表面可以制成半吸水性，并且疏水表面可以由具有相同通用特征的颗粒制成半吸收。
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公开(公告)号：US07927925B2
公开(公告)日：2011-04-19
申请号：US12756380
申请日：2010-04-08
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
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公开(公告)号：US20100190302A1
公开(公告)日：2010-07-29
申请号：US12756380
申请日：2010-04-08
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
摘要翻译： 通过改变包装表面的粗糙度，可以在集成电路封装中形成扩展或保留区域。 可以通过施加或生长具有小于500纳米尺寸的颗粒来改变表面粗糙度。 亲水性表面可以制成半吸水性，并且疏水表面可以由具有相同通用特征的颗粒制成半吸收。
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5.发明申请公开(公告)号：US20080067502A1
公开(公告)日：2008-03-20
申请号：US11521147
申请日：2006-09-14
IPC分类号： H01L51/00
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
摘要翻译： 通过改变包装表面的粗糙度，可以在集成电路封装中形成扩展或保留区域。 可以通过施加或生长具有小于500纳米尺寸的颗粒来改变表面粗糙度。 亲水性表面可以制成半吸水性，并且疏水表面可以由具有相同通用特征的颗粒制成半吸收。
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6.发明申请Microelectronic package including thermally conductive sealant between heat spreader and substrate 审中-公开微电子封装，包括散热器和基板之间的导热密封剂公开(公告)号：US20080237843A1
公开(公告)日：2008-10-02
申请号：US11729079
申请日：2007-03-27
申请人： Ashish Gupta , Leonel R. Arana , David Song , Chia-Pin Chiu , Ravi Prasher , Chris Matayabas , Nirupama Chakrapani
发明人： Ashish Gupta , Leonel R. Arana , David Song , Chia-Pin Chiu , Ravi Prasher , Chris Matayabas , Nirupama Chakrapani
IPC分类号： H01L23/367 , H01L21/58
CPC分类号： H01L23/10 , H01L23/04 , H01L2224/73253 , H01L2924/1433
摘要： A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.
摘要翻译： 微电子封装。 所述包装包括基材; 安装在基板上的管芯; 集成散热器，其安装在基板上，并热耦合到模具的背面; 以及将整体散热器粘合到基底上的密封剂材料，所述密封剂材料具有高于约1W / m /℃的体积热导率，并且弹性模量低于焊料的弹性模量。
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7.发明申请公开(公告)号：US20080233396A1
公开(公告)日：2008-09-25
申请号：US11689288
申请日：2007-03-21
CPC分类号： H01L51/444 , B82Y10/00 , B82Y30/00 , H01L51/0048 , H01L51/0575 , H01L51/0579 , Y02E10/549
摘要： Methods and associated structures of forming microelectronic devices are described. Those methods may include method of forming a layered nanotube structure comprising a wetting layer disposed on a nanotube, a Shottky layer disposed on the wetting layer, a barrier layer disposed on the Shottky layer, and a matrix layer disposed on the barrier layer.
摘要翻译： 描述形成微电子器件的方法和相关结构。 这些方法可以包括形成层状纳米管结构的方法，其包括设置在纳米管上的润湿层，设置在润湿层上的肖特基层，设置在肖特基层上的阻挡层和设置在阻挡层上的矩阵层。
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8.发明授权Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivities and structures formed thereby 有权形成碳纳米管结构和复合材料的方法具有由此形成的高电导率和热导率和结构公开(公告)号：US08158968B2
公开(公告)日：2012-04-17
申请号：US11689288
申请日：2007-03-21
IPC分类号： H01L29/06
CPC分类号： H01L51/444 , B82Y10/00 , B82Y30/00 , H01L51/0048 , H01L51/0575 , H01L51/0579 , Y02E10/549
摘要： Methods and associated structures of forming microelectronic devices are described. Those methods may include method of forming a layered nanotube structure comprising a wetting layer disposed on a nanotube, a Shottky layer disposed on the wetting layer, a barrier layer disposed on the Shottky layer, and a matrix layer disposed on the barrier layer.
摘要翻译： 描述形成微电子器件的方法和相关结构。 这些方法可以包括形成层状纳米管结构的方法，其包括设置在纳米管上的润湿层，设置在润湿层上的肖特基层，设置在肖特基层上的阻挡层和设置在阻挡层上的矩阵层。
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公开(公告)号：US20050139962A1
公开(公告)日：2005-06-30
申请号：US10748446
申请日：2003-12-30
申请人： Ashay Dani , Gudbjorg Oskarsdottir , Chris Matayabas , Sujit Sharan , Chris Rumer , Beverly Canham
发明人： Ashay Dani , Gudbjorg Oskarsdottir , Chris Matayabas , Sujit Sharan , Chris Rumer , Beverly Canham
IPC分类号： H01L21/44 , H01L21/78 , H01L23/544
CPC分类号： H01L21/78 , H01L2224/16 , H01L2924/01019 , H01L2924/10253 , H01L2924/00
摘要： A silicon wafer has a plurality of integrated circuits terminated on a surface of the silicon wafer. The silicon wafer has a soluble protective coat on the surface of the silicon wafer. The coated silicon wafer may be processed by laser scribing. A solvent wash may be used to remove the soluble protective coat and debris from laser scribing. The coated silicon wafer may be saw cut after laser scribing. A flow of solvent may be provided during the saw cutting. The flow of solvent may be sufficient to remove at least a substantial portion of the soluble protective coat.
摘要翻译： 硅晶片具有端接在硅晶片表面上的多个集成电路。 硅晶片在硅晶片的表面上具有可溶的保护涂层。 涂覆的硅晶片可以通过激光划线来加工。 可以使用溶剂洗涤剂从激光划线中除去可溶性保护涂层和碎屑。 涂覆的硅晶片可以在激光划线之后锯切。 在锯切期间可以提供溶剂流。 溶剂的流动可能足以除去至少大部分的可溶性保护涂层。
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10.发明授权Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivites and structures formed thereby 有权形成碳纳米管结构的方法和具有由此形成的高电导率和导热系数和结构的复合材料公开(公告)号：US08558218B2
公开(公告)日：2013-10-15
申请号：US13371749
申请日：2012-02-13
IPC分类号： H01L31/00
CPC分类号： H01L51/444 , B82Y10/00 , B82Y30/00 , H01L51/0048 , H01L51/0575 , H01L51/0579 , Y02E10/549
摘要： Methods and associated structures of forming microelectronic devices are described. Those methods may include method of forming a layered nanotube structure comprising a wetting layer disposed on a nanotube, a Shottky layer disposed on the wetting layer, a barrier layer disposed on the Shottky layer, and a matrix layer disposed on the barrier layer.
摘要翻译： 描述形成微电子器件的方法和相关结构。 这些方法可以包括形成层状纳米管结构的方法，其包括设置在纳米管上的润湿层，设置在润湿层上的肖特基层，设置在肖特基层上的阻挡层和设置在阻挡层上的矩阵层。
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