发明申请
- 专利标题： METHODS OF REMOVING WATER FROM SEMICONDUCTOR SUBSTRATES AND METHODS OF DEPOSITING ATOMIC LAYERS USING THE SAME
- 专利标题（中）： 从半导体基板去除水的方法及使用其沉积原子层的方法
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申请号： US12688044申请日： 2010-01-15
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公开(公告)号： US20100190320A1公开(公告)日： 2010-07-29
- 发明人: Ki-chul Kim , Youn-soo Kim , Ki-vin Im , Cha-young Yoo , Jong-cheol Lee , Ki-yeon Park , Hoon-sang Choi , Se-hoon Oh
- 申请人： Ki-chul Kim , Youn-soo Kim , Ki-vin Im , Cha-young Yoo , Jong-cheol Lee , Ki-yeon Park , Hoon-sang Choi , Se-hoon Oh
- 优先权： KR10-2009-0006985 20090129
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; B08B3/00
摘要：
Provided are methods of removing water adsorbed or bonded to a surface of a semiconductor substrate, and methods of depositing an atomic layer using the method of removing water described herein. The method of removing water includes applying a chemical solvent to the surface of a semiconductor substrate, and removing the chemical solvent from the surface of the semiconductor substrate.