A laser cutting system including a chamber configured to provide a controlled environment while the laser is being used to cut a pattern into a material to reduce or eliminate heat and oxygen related changes to the mechanical characteristics of the material. A system for providing a gas to the controlled environment within the chamber, as well as a means for exhausting gas and cutting debris from the chamber is also described. A cutting mandrel that provides for flow of a shielding gas and also provides a means for dispersing a laser beam before it can produce unwanted damage to a section of tubing is also described.