发明申请
- 专利标题： LIGHT EMITTING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 发光半导体器件及其制造方法
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申请号： US12695163申请日： 2010-01-28
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公开(公告)号： US20100193822A1公开(公告)日： 2010-08-05
- 发明人: Mototaka INOBE , Motokazu Yamada , Kazuhiro Kamada
- 申请人： Mototaka INOBE , Motokazu Yamada , Kazuhiro Kamada
- 申请人地址： JP Anan-shi
- 专利权人： NICHIA CORPORATION
- 当前专利权人： NICHIA CORPORATION
- 当前专利权人地址： JP Anan-shi
- 优先权： JP2009-19412 20090130; JP2009-268587 20091126
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/50
摘要：
The light emitting device has a substrate, metallization including silver established on the surface of the substrate, a light emitting element mounted on the substrate, conducting wire that electrically connects the metallization and the light emitting element, light reflective resin provided on the substrate to reflect light from the light emitting element, and insulating material that covers at least part of the metallization surfaces. The insulating material is established to come in contact with the side of the light emitting element. This arrangement can suppress the leakage of light emitting element light from the substrate, and can achieve a light emitting device with high light extraction efficiency.
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