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1.
公开(公告)号:US20130037842A1
公开(公告)日:2013-02-14
申请号:US13577491
申请日:2011-01-28
申请人: Motokazu Yamada , Ryota Seno , Kazuhiro Kamada
发明人: Motokazu Yamada , Ryota Seno , Kazuhiro Kamada
IPC分类号: H01L33/60
CPC分类号: H01L33/60 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0753 , H01L25/167 , H01L33/005 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/52 , H01L33/54 , H01L33/62 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01065 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00 , H01L2924/2076 , H01L2224/05599 , H01L2924/00012
摘要: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
摘要翻译: 发光装置(100)包括基座(101),设置在基座构件(101)上的导电构件(102a,102b),安装在导电构件(102a,102b)上的发光元件 ,覆盖未安装发光元件(104)的导电构件(102a,102b)的表面的至少一部分的绝缘填料(114)和覆盖发光元件的透光构件(108) 104)。
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公开(公告)号:US08049237B2
公开(公告)日:2011-11-01
申请号:US12341189
申请日:2008-12-22
申请人: Motokazu Yamada , Mototaka Inobe
发明人: Motokazu Yamada , Mototaka Inobe
IPC分类号: H01L33/00
CPC分类号: H01L33/46 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48137 , H01L2224/48465 , H01L2224/4945 , H01L2924/01322 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要: A light emitting device includes a substrate provided with a conductor wiring, a light emitting element mounted on the substrate and a light reflecting resin member configured and arranged to reflect light emitted from the light emitting element. The light emitting device also includes at least one of an electrically conductive wire electrically connecting the conductor wiring and the light emitting element, an exposed region of the substrate on which the conductor wiring is not disposed, and a protective element mounted on the conductor wiring. At least a part of the electrically conductive wire, the exposed region or the protective element is buried in the light reflecting resin member.
摘要翻译: 一种发光器件,包括设置有导体布线的基板,安装在基板上的发光元件和被配置为布置成反射从发光元件发射的光的光反射树脂部件。 发光装置还包括电连接导体布线和发光元件的导电线,未布置导体布线的基板的暴露区域和安装在导体布线上的保护元件中的至少一个。 至少一部分导电线,暴露区域或保护元件被埋在光反射树脂构件中。
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公开(公告)号:US07964113B2
公开(公告)日:2011-06-21
申请号:US12453535
申请日:2009-05-14
申请人: Hiroto Tamaki , Masatoshi Kameshima , Suguru Takashima , Motokazu Yamada , Takahiro Naitou , Kazuhiko Sakai , Yoshinori Murazaki
发明人: Hiroto Tamaki , Masatoshi Kameshima , Suguru Takashima , Motokazu Yamada , Takahiro Naitou , Kazuhiko Sakai , Yoshinori Murazaki
CPC分类号: H01L33/502 , C01B21/0602 , C01B21/0821 , C01P2002/52 , C01P2002/84 , C01P2004/03 , C01P2004/61 , C04B35/44 , C04B35/584 , C04B35/597 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3286 , C04B2235/3852 , C04B2235/3873 , C04B2235/3895 , C04B2235/764 , C09K11/0883 , C09K11/77 , C09K11/7702 , C09K11/7703 , C09K11/7728 , C09K11/773 , C09K11/7731 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/01019 , H01L2924/01021 , H01L2924/01037 , H01L2924/01055 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/00012
摘要: To provide a phosphor containing a comparatively much red component and having high light emitting efficiency, high brightness and further high durability, the nitride phosphor is represented by the general formula LXMYN((2/3)X+(4/3)Y):R or LXMYOZN((2/3)X+(4/3)Y−(2/3)Z):R (wherein L is at least one or more selected from the Group II Elements consisting of Mg, Ca, Sr, Ba and Zn, M is at least one or more selected from the Group IV Elements in which Si is essential among C, Si and Ge, and R is at least one or more selected from the rare earth elements in which Eu is essential among Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er and Lu.); contains the another elements.
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公开(公告)号:US20100264447A1
公开(公告)日:2010-10-21
申请号:US12827665
申请日:2010-06-30
申请人: Isamu NIKI , Motokazu Yamada , Masahiko Sano , Shuji Shioji
发明人: Isamu NIKI , Motokazu Yamada , Masahiko Sano , Shuji Shioji
CPC分类号: H01L33/16 , H01L21/02378 , H01L21/0254 , H01L21/02647 , H01L33/007 , H01L33/20 , H01L33/22 , H01L33/24 , H01L33/26 , H01L33/32 , H01L2933/0083 , Y10T428/24355 , Y10T428/24479
摘要: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
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公开(公告)号:US07804101B2
公开(公告)日:2010-09-28
申请号:US10897163
申请日:2004-07-23
申请人: Isamu Niki , Motokazu Yamada , Masahiko Sano , Shuji Shioji
发明人: Isamu Niki , Motokazu Yamada , Masahiko Sano , Shuji Shioji
IPC分类号: H01L33/00
CPC分类号: H01L33/16 , H01L21/02378 , H01L21/0254 , H01L21/02647 , H01L33/007 , H01L33/20 , H01L33/22 , H01L33/24 , H01L33/26 , H01L33/32 , H01L2933/0083 , Y10T428/24355 , Y10T428/24479
摘要: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
摘要翻译: 提供了包括基板,电极和发光区域的半导体发光器件。 基板可以具有在基板的基本上整个表面上以重复图案形成的突出部分,而表面的其余部分可以基本上是平坦的。 沿着与基板的表面正交的平面截取的突出部分的横截面可以是半圆形的。 突出部分的横截面可以是凸起的形状。 可以在衬底上形成缓冲层和GaN层。
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公开(公告)号:USD622683S1
公开(公告)日:2010-08-31
申请号:US29359245
申请日:2010-04-07
申请人: Motokazu Yamada
设计人: Motokazu Yamada
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7.
公开(公告)号:US20100193822A1
公开(公告)日:2010-08-05
申请号:US12695163
申请日:2010-01-28
申请人: Mototaka INOBE , Motokazu Yamada , Kazuhiro Kamada
发明人: Mototaka INOBE , Motokazu Yamada , Kazuhiro Kamada
CPC分类号: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: The light emitting device has a substrate, metallization including silver established on the surface of the substrate, a light emitting element mounted on the substrate, conducting wire that electrically connects the metallization and the light emitting element, light reflective resin provided on the substrate to reflect light from the light emitting element, and insulating material that covers at least part of the metallization surfaces. The insulating material is established to come in contact with the side of the light emitting element. This arrangement can suppress the leakage of light emitting element light from the substrate, and can achieve a light emitting device with high light extraction efficiency.
摘要翻译: 发光器件具有衬底,包括建立在衬底表面上的银的金属化,安装在衬底上的发光元件,电连接金属化和发光元件的导线,设置在衬底上的光反射树脂以反射 来自发光元件的光以及覆盖金属化表面的至少一部分的绝缘材料。 建立绝缘材料以与发光元件的一侧接触。 这种布置可以抑制发光元件光从衬底的泄漏,并且可以实现具有高光提取效率的发光器件。
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公开(公告)号:USD619975S1
公开(公告)日:2010-07-20
申请号:US29344931
申请日:2009-10-06
申请人: Motokazu Yamada
设计人: Motokazu Yamada
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公开(公告)号:US07736019B2
公开(公告)日:2010-06-15
申请号:US11544706
申请日:2006-10-10
申请人: Junichi Shimada , Yoichi Kawakami , Motokazu Yamada , Masaru Kato
发明人: Junichi Shimada , Yoichi Kawakami , Motokazu Yamada , Masaru Kato
IPC分类号: F21V5/00
CPC分类号: F21V5/04 , F21S8/026 , F21S8/04 , F21V5/003 , F21V9/00 , F21V13/02 , F21V29/763 , F21V29/89 , F21W2131/301 , F21W2131/304 , F21W2131/402 , F21Y2103/10 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10
摘要: The lighting system according to the present invention includes an electrical wiring substrate in which a connector to a power source is formed, a plurality of LED chips mounted in a predetermined array pattern on the electrical wiring substrate, a deflection lens array disposed in proximity to the LED chips between the LED chip and the predetermined illumination region and a housing for receiving the electrical wiring substrate and the deflection lens array. A plurality of deflection lenses are integrally molded in the deflection lens array to lead lights from the LED chips to the predetermined illumination region in a state where the lights from the LED chips are superposed with each other. The lights emitted from the LED chips are collected in a state where they all are superposed in a common, single illumination region through the deflection lenses.
摘要翻译: 根据本发明的照明系统包括:电布线基板,其中形成有连接到电源的连接器,在电布线基板上以预定的阵列图案安装的多个LED芯片;偏转透镜阵列, LED芯片和预定照明区域之间的LED芯片和用于接收电布线基板和偏转透镜阵列的壳体。 多个偏转透镜一体地模制在偏转透镜阵列中,以使来自LED芯片的光彼此重叠的状态将LED从LED芯片引导到预定的照明区域。 从LED芯片发出的光线通过偏转透镜以共同的单个照明区域重叠的状态被收集。
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公开(公告)号:US20090230840A1
公开(公告)日:2009-09-17
申请号:US12453534
申请日:2009-05-14
申请人: Hiroto Tamaki , Masatoshi Kameshima , Suguru Takashima , Motokazu Yamada , Takahiro Naitou , Kazuhiko Sakai , Yoshinori Murazaki
发明人: Hiroto Tamaki , Masatoshi Kameshima , Suguru Takashima , Motokazu Yamada , Takahiro Naitou , Kazuhiko Sakai , Yoshinori Murazaki
IPC分类号: H01J1/62
CPC分类号: H01L33/502 , C01B21/0602 , C01B21/0821 , C01P2002/52 , C01P2002/84 , C01P2004/03 , C01P2004/61 , C04B35/44 , C04B35/584 , C04B35/597 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3286 , C04B2235/3852 , C04B2235/3873 , C04B2235/3895 , C04B2235/764 , C09K11/0883 , C09K11/77 , C09K11/7702 , C09K11/7703 , C09K11/7728 , C09K11/773 , C09K11/7731 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/01019 , H01L2924/01021 , H01L2924/01037 , H01L2924/01055 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/00012
摘要: To provide a phosphor containing a comparatively much red component and having high light emitting efficiency, high brightness and further high durability, the nitride phosphor is represented by the general formula LXMYN((2/3)X+(4/3)Y):R or LXMYOZN((2/3)X+(4/3)Y−(2/3)Z):R (wherein L is at least one or more selected from the Group II Elements consisting of Mg, Ca, Sr, Ba and Zn, M is at least one or more selected from the Group IV Elements in which Si is essential among C, Si and Ge, and R is at least one or more selected from the rare earth elements in which Eu is essential among Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er and Lu.); contains the another elements.
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