Invention Application
- Patent Title: LIGHT EMITTING DEVICE AND PACKAGE HAVING THE SAME
- Patent Title (中): 发光装置和具有该发光装置的包装
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Application No.: US12756824Application Date: 2010-04-08
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Publication No.: US20100193828A1Publication Date: 2010-08-05
- Inventor: Pun Jae CHOI , Jin Hyun Lee , Si Hyuk Lee , Seon Young Myoung , Ki Yeol Park
- Applicant: Pun Jae CHOI , Jin Hyun Lee , Si Hyuk Lee , Seon Young Myoung , Ki Yeol Park
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Priority: KR10-2007-0030923 20070329
- Main IPC: H01L33/62
- IPC: H01L33/62

Abstract:
There is provided a light emitting device that can minimize reflection or absorption of emitted light, maximize luminous efficiency with the maximum light emitting area, enable uniform current spreading with a small area electrode, and enable mass production at low cost with high reliability and high quality. A light emitting device according to an aspect of the invention includes a light emitting lamination including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, and a conductive substrate at one surface thereof. Here, the light emitting device includes a barrier unit separating the light emitting lamination into a plurality of light emitting regions, a first electrode structure, and a second electrode structure. The first electrode structure includes a bonding unit, contact holes, and a wiring unit connecting the bonding unit to the contact holes.
Public/Granted literature
- US08063407B2 Light emitting device and package having the same for maximizing light emitting area Public/Granted day:2011-11-22
Information query
IPC分类: