发明申请
US20100193971A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING, METHOD FOR FORMING CURED FILM USING THE SAME, CURED FILM, AND SEMICONDUCTOR DEVICE
审中-公开
用于喷涂的阳性感光树脂组合物，使用其形成固化膜的方法，固化膜和半导体器件
- 专利标题： POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING, METHOD FOR FORMING CURED FILM USING THE SAME, CURED FILM, AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 用于喷涂的阳性感光树脂组合物，使用其形成固化膜的方法，固化膜和半导体器件
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申请号： US12670505申请日： 2008-07-22
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公开(公告)号： US20100193971A1公开(公告)日： 2010-08-05
- 发明人: Toshio Banba , Hideki Orihara
- 申请人： Toshio Banba , Hideki Orihara
- 优先权： JP2007-193973 20070726; JP2008-118233 20080430
- 国际申请： PCT/JP2008/063120 WO 20080722
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; G03F7/004 ; G03F7/20
摘要：
A positive photosensitive resin composition for spray coating of the present invention is used for forming a coating film onto a substrate such as a semiconductor element mounting substrate, a ceramics substrate or an aluminium substrate by spray coating. The positive photosensitive resin composition is characterized by containing (A) an alkali soluble resin, (B) a compound which generates an acid by the action of light and (C) a solvent, and having a viscosity of 2 to 200 cP.
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