Invention Application
US20100197079A1 SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENTS MOUNTED ON BASE PLATE
有权
半导体器件包括在基板上安装的半导体元件
- Patent Title: SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENTS MOUNTED ON BASE PLATE
- Patent Title (中): 半导体器件包括在基板上安装的半导体元件
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Application No.: US12759919Application Date: 2010-04-14
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Publication No.: US20100197079A1Publication Date: 2010-08-05
- Inventor: Shinji Ohuchi , Shigeru Yamada , Yasushi Shiraishi
- Applicant: Shinji Ohuchi , Shigeru Yamada , Yasushi Shiraishi
- Applicant Address: JP Kanagawa
- Assignee: OKI SEMICONDUCTOR CO., LTD.
- Current Assignee: OKI SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP11-187658 19990701
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/60
Abstract:
A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.
Public/Granted literature
- US08008129B2 Method of making semiconductor device packaged by sealing resin member Public/Granted day:2011-08-30
Information query
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