发明申请
US20100197079A1 SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENTS MOUNTED ON BASE PLATE
有权
半导体器件包括在基板上安装的半导体元件
- 专利标题： SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENTS MOUNTED ON BASE PLATE
- 专利标题（中）： 半导体器件包括在基板上安装的半导体元件
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申请号： US12759919申请日： 2010-04-14
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公开(公告)号： US20100197079A1公开(公告)日： 2010-08-05
- 发明人: Shinji Ohuchi , Shigeru Yamada , Yasushi Shiraishi
- 申请人： Shinji Ohuchi , Shigeru Yamada , Yasushi Shiraishi
- 申请人地址： JP Kanagawa
- 专利权人： OKI SEMICONDUCTOR CO., LTD.
- 当前专利权人： OKI SEMICONDUCTOR CO., LTD.
- 当前专利权人地址： JP Kanagawa
- 优先权： JP11-187658 19990701
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/60
摘要：
A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.
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