发明申请
US20100200856A1 METHOD FOR MANUFACTURING E-JPAPER ARRAY SUBSTRATE AND E-PAPER ARRAY SUBSTRATE
有权
制造E-JPAPER阵列基板和电子纸阵列基板的方法
- 专利标题： METHOD FOR MANUFACTURING E-JPAPER ARRAY SUBSTRATE AND E-PAPER ARRAY SUBSTRATE
- 专利标题（中）： 制造E-JPAPER阵列基板和电子纸阵列基板的方法
-
申请号： US12628878申请日： 2009-12-01
-
公开(公告)号： US20100200856A1公开(公告)日： 2010-08-12
- 发明人: Wenjie HU , Zenghui SUN , Hongyu LIU , Gang WANG , Xibin SHAO
- 申请人： Wenjie HU , Zenghui SUN , Hongyu LIU , Gang WANG , Xibin SHAO
- 申请人地址： CN Beijing
- 专利权人： BOE TECHNOLOGY GROUP CO., LTD
- 当前专利权人： BOE TECHNOLOGY GROUP CO., LTD
- 当前专利权人地址： CN Beijing
- 优先权： CN200910077717.5 20090212
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/28
摘要：
A method for manufacturing E-paper array substrate and an E-paper array substrate are provided. The method for manufacturing E-paper array substrate uses two masks. Steps on a surface of the array substrate structure are eliminated, so as to facilitate a subsequent coating process of E-ink and enable a uniform distribution of a drain electric field. An E-paper array substrate is further provided.
公开/授权文献
信息查询
IPC分类:
