发明申请
- 专利标题： Electronic-Component-Housing Package and Electronic Device
- 专利标题（中）： 电子部件 - 外壳封装和电子设备
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申请号： US12602461申请日： 2008-03-27
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公开(公告)号： US20100200932A1公开(公告)日： 2010-08-12
- 发明人: Yoshiaki Ueda
- 申请人： Yoshiaki Ueda
- 申请人地址： JP Kyoto-shi, Kyoto
- 专利权人： KYOCERA CORPORATION
- 当前专利权人： KYOCERA CORPORATION
- 当前专利权人地址： JP Kyoto-shi, Kyoto
- 优先权： JP2007-142125 20070529; JP2007-307969 20071128
- 国际申请： PCT/JP2008/055929 WO 20080327
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/48 ; H01L23/498
摘要：
An electronic-component-housing package comprises a container including a rectangular mount on which an electronic component is to be mounted and a sidewall surrounding the mount. The electronic-component-housing package comprises a lead terminal extending from an inside of a space enclosed by the sidewall to an outside of the space. A tip part of the lead terminal is extending along one side of the mount.
公开/授权文献
- US08405200B2 Electronic-component-housing package and electronic device 公开/授权日：2013-03-26
信息查询
IPC分类:
