发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE
- 专利标题（中）： 半导体器件和半导体存储器件
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申请号： US12762401申请日： 2010-04-19
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公开(公告)号： US20100200976A1公开(公告)日： 2010-08-12
- 发明人: Taku NISHIYAMA , Tetsuya YAMAMOTO , Kiyokazu OKADA
- 申请人： Taku NISHIYAMA , Tetsuya YAMAMOTO , Kiyokazu OKADA
- 申请人地址： JP Minato-ku
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Minato-ku
- 优先权： JP2007-255633 20070928
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/52
摘要：
A plurality of semiconductor elements configuring a first element group are stacked in a step-like shape on a wiring board. A plurality of semiconductor elements configuring a second element group are stacked in a step-like shape on the first element group toward a direction opposite to the stepped direction of the first element group. The semiconductor elements are electrically connected to connection pads of the wiring board through metallic wires. Among the plurality of semiconductor elements configuring the second element group, the lowermost semiconductor element has a thickness larger than those of the other semiconductor elements.
公开/授权文献
- US07944037B2 Semiconductor device and semiconductor memory device 公开/授权日：2011-05-17