发明申请
- 专利标题： ELECTRONIC COMPONENT
- 专利标题（中）： 电子元件
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申请号： US12673098申请日： 2009-02-16
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公开(公告)号： US20100200983A1公开(公告)日： 2010-08-12
- 发明人: Kazuyuki Ono , Yoshio Tanaka , Kiyoshi Nakajima , Naoto Kuratani , Tomofumi Maekawa
- 申请人： Kazuyuki Ono , Yoshio Tanaka , Kiyoshi Nakajima , Naoto Kuratani , Tomofumi Maekawa
- 申请人地址： JP Kyoto-shi, Kyoto
- 专利权人： OMRON CORPORATION
- 当前专利权人： OMRON CORPORATION
- 当前专利权人地址： JP Kyoto-shi, Kyoto
- 优先权： JP2008-172109 20080701
- 国际申请： PCT/JP2009/000608 WO 20090216
- 主分类号： H01L23/04
- IPC分类号： H01L23/04
摘要：
An electronic component has a board, a semiconductor element mounted on an upper surface of the board, a ground electrode formed in a region surrounding the semiconductor element on the upper surface of the board, a conductive cap that overlaps the board such that the semiconductor element is covered therewith, and a conductive joining member that joins a whole periphery of a lower surface of the conductive cap to the ground electrode. The conductive cap includes a pressing portion on the lower surface thereof The lower surface of the conductive cap and the ground electrode are joined by the conductive joining member on an outer peripheral side of the pressing portion.
公开/授权文献
- US08314485B2 Electronic component 公开/授权日：2012-11-20
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