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公开(公告)号：US20120139111A1
公开(公告)日：2012-06-07
申请号：US12674701
申请日：2009-02-17
IPC分类号： H01L23/488 , H01L23/12
CPC分类号： H01L23/055 , B81B2201/0257 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , B81C2203/032 , H01L23/552 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/2919 , H01L2224/29191 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/10158 , H01L2924/1433 , H01L2924/1461 , H01L2924/16152 , H01L2924/3025 , H01L2924/0715 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic component has a substrate, a die bonding pad provided on an upper surface of the substrate, a semiconductor element bonded onto the die bonding pad by a die bonding resin, a conductive pattern disposed adjacent to the die bonding pad, and a coating member covering the conductive pattern. At least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material. The inorganic material of the outer peripheral portion is exposed. The die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.
摘要翻译： 电子部件具有基板，设置在基板的上表面的芯片接合焊盘，通过芯片接合树脂接合在芯片接合焊盘上的半导体元件，与芯片接合焊盘相邻配置的导电图案，以及涂敷部件 覆盖导电图案。 芯片接合焊盘的表面的至少外周部由无机材料构成。 露出外周部的无机材料。 芯片接合焊盘和导电图案被气隙隔开，使得涂层部件不与焊盘接合。
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公开(公告)号：US20110044017A1
公开(公告)日：2011-02-24
申请号：US12674694
申请日：2009-02-18
CPC分类号： H01L23/12 , H01L23/055 , H01L23/13 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/05553 , H01L2224/05554 , H01L2224/16235 , H01L2224/2919 , H01L2224/29191 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/73265 , H01L2224/83 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1433 , H01L2924/16152 , H01L2924/166 , H05K3/305 , H05K9/0026 , H05K2201/09036 , H01L2924/00014 , H01L2924/0715 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.
摘要翻译： 电子部件具有印刷基板，其具有芯片接合部，通过芯片接合树脂与印刷基板的芯片接合部分刚性地接合的半导体元件，以及通过印刷基板上的导体图案形成的引线接合端子，所述导线图案被连接 通过接合线连接到半导体元件。 在位于引线接合端子周围的区域中的至少芯片接合部侧的区域中，形成位于比印刷基板的导体图案低的位置的槽部。
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公开(公告)号：US20100200983A1
公开(公告)日：2010-08-12
申请号：US12673098
申请日：2009-02-16
IPC分类号： H01L23/04
CPC分类号： H05K3/341 , H01L23/055 , H01L23/10 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/16152 , H01L2924/16251 , H01L2924/16315 , H01L2924/1632 , H01L2924/3025 , H05K3/3452 , H05K2201/099 , H05K2201/10371 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component has a board, a semiconductor element mounted on an upper surface of the board, a ground electrode formed in a region surrounding the semiconductor element on the upper surface of the board, a conductive cap that overlaps the board such that the semiconductor element is covered therewith, and a conductive joining member that joins a whole periphery of a lower surface of the conductive cap to the ground electrode. The conductive cap includes a pressing portion on the lower surface thereof The lower surface of the conductive cap and the ground electrode are joined by the conductive joining member on an outer peripheral side of the pressing portion.
摘要翻译： 电子部件具有基板，安装在基板的上表面的半导体元件，形成在基板上表面上的半导体元件周围的区域的接地电极，与基板重叠的导电盖，使得半导体元件 并且将导电盖的下表面的整个周边连接到接地电极的导电接合部件。 导电盖包括在其下表面上的按压部分。导电盖的下表面和接地电极通过导电接合部件在按压部分的外周侧上接合。
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公开(公告)号：US08338950B2
公开(公告)日：2012-12-25
申请号：US12674701
申请日：2009-02-17
IPC分类号： H01L23/488
CPC分类号： H01L23/055 , B81B2201/0257 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , B81C2203/032 , H01L23/552 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/2919 , H01L2224/29191 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/10158 , H01L2924/1433 , H01L2924/1461 , H01L2924/16152 , H01L2924/3025 , H01L2924/0715 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic component has a substrate, a die bonding pad provided on an upper surface of the substrate, a semiconductor element bonded onto the die bonding pad by a die bonding resin, a conductive pattern disposed adjacent to the die bonding pad, and a coating member covering the conductive pattern. At least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material. The inorganic material of the outer peripheral portion is exposed. The die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.
摘要翻译： 电子部件具有基板，设置在基板的上表面的芯片接合焊盘，通过芯片接合树脂接合在芯片接合焊盘上的半导体元件，与芯片接合焊盘相邻配置的导电图案，以及涂敷部件 覆盖导电图案。 芯片接合焊盘的表面的至少外周部由无机材料构成。 露出外周部的无机材料。 芯片接合焊盘和导电图案被气隙隔开，使得涂层部件不与焊盘接合。
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公开(公告)号：US08314485B2
公开(公告)日：2012-11-20
申请号：US12673098
申请日：2009-02-16
IPC分类号： H01L23/04
CPC分类号： H05K3/341 , H01L23/055 , H01L23/10 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/16152 , H01L2924/16251 , H01L2924/16315 , H01L2924/1632 , H01L2924/3025 , H05K3/3452 , H05K2201/099 , H05K2201/10371 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component has a board, a semiconductor element mounted on an upper surface of the board, a ground electrode formed in a region surrounding the semiconductor element on the upper surface of the board, a conductive cap that overlaps the board such that the semiconductor element is covered therewith, and a conductive joining member that joins a whole periphery of a lower surface of the conductive cap to the ground electrode. The conductive cap includes a pressing portion on the lower surface thereof The lower surface of the conductive cap and the ground electrode are joined by the conductive joining member on an outer peripheral side of the pressing portion.
摘要翻译： 电子部件具有基板，安装在基板的上表面的半导体元件，形成在基板上表面上的半导体元件周围的区域的接地电极，与基板重叠的导电盖，使得半导体元件 并且将导电盖的下表面的整个周边连接到接地电极的导电接合部件。 导电盖包括在其下表面上的按压部分。导电盖的下表面和接地电极通过导电接合部件在按压部分的外周侧上接合。
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公开(公告)号：US08274797B2
公开(公告)日：2012-09-25
申请号：US12674694
申请日：2009-02-18
IPC分类号： H05K7/00
CPC分类号： H01L23/12 , H01L23/055 , H01L23/13 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/05553 , H01L2224/05554 , H01L2224/16235 , H01L2224/2919 , H01L2224/29191 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/73265 , H01L2224/83 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1433 , H01L2924/16152 , H01L2924/166 , H05K3/305 , H05K9/0026 , H05K2201/09036 , H01L2924/00014 , H01L2924/0715 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.
摘要翻译： 电子部件具有印刷基板，其具有芯片接合部，通过芯片接合树脂与印刷基板的芯片接合部分刚性地接合的半导体元件，以及通过印刷基板上的导体图案形成的引线接合端子，所述导线图案被连接 通过接合线连接到半导体元件。 在位于引线接合端子周围的区域中的至少芯片接合部侧的区域中，形成位于比印刷基板的导体图案低的位置的槽部。
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公开(公告)号：US20130130493A1
公开(公告)日：2013-05-23
申请号：US13744558
申请日：2013-01-18
申请人： Naoto Kuratani , Kazuyuki Ono , Tomofumi Maekawa
发明人： Naoto Kuratani , Kazuyuki Ono , Tomofumi Maekawa
IPC分类号： H01L23/00
CPC分类号： H01L24/03 , B81B7/007 , B81B2207/012 , B81B2207/07 , H01L21/4878 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/49833 , H01L23/552 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48471 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15153 , H01L2924/15156 , H01L2924/15165 , H01L2924/1517 , H01L2924/1617 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A connecting pad producing method has a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded, a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer, and a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member. The conductive layer with which the insulating member is coated is removed so as not to reach the conductive layer surface in a region adjacent to the insulating member in the third process.
摘要翻译： 连接垫的制造方法具有将基材的表面中的绝缘部件突出使得形成有连接焊盘的区域被包围的第一工序，在基材的表面形成导电层的第二工序，例如 所述绝缘部件被所述导电层覆盖，以及去除所述绝缘部件的所述导电层被涂覆的第3工序，使所述绝缘部件从所述导电层的整个周边露出，以及形成包括所述导电层的所述连接焊盘 在由绝缘构件包围的区域中。 在第三工序中，除去绝缘部件的导电层，使其不与绝缘部件相邻的区域到达导电层表面。
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公开(公告)号：US20110222717A1
公开(公告)日：2011-09-15
申请号：US13033818
申请日：2011-02-24
申请人： Naoto Kuratani , Kazuyuki Ono , Tomofumi Maekawa
发明人： Naoto Kuratani , Kazuyuki Ono , Tomofumi Maekawa
CPC分类号： H04R19/04 , H01L2224/48091 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/1461 , H01L2924/3025 , H04R19/005 , H04R31/00 , H01L2924/00014 , H01L2924/00
摘要： The semiconductor device has a simplified structure which includes a package structure in which a member for mounting a semiconductor element is separate from a member including a signal input/output unit. A microphone package is configured with a cover and a substrate. A microphone chip and a circuit element are adhered and fixed to a top surface of a recess formed in the cover. A plurality of bonding pads are arranged on the lower surface of the cover on the outer side of the recess. A bonding wire is connected to the circuit element and the bonding pad. The substrate includes a signal input/output terminal serving as the signal input/output unit, and a connection electrode, conducted with the signal input/output terminal, is arranged facing the bonding pad on the upper surface of the substrate. The substrate, cover, connection electrode, and bonding pad are joined with a conductive member.
摘要翻译： 半导体器件具有简化的结构，其包括其中用于安装半导体元件的部件与包括信号输入/输出单元的部件分离的封装结构。 麦克风封装配置有盖和基板。 麦克风芯片和电路元件被粘附并固定到形成在盖中的凹部的顶表面。 在凹部的外侧的盖的下表面上设置有多个接合焊盘。 接合线连接到电路元件和接合焊盘。 基板包括用作信号输入/输出单元的信号输入/输出端子，并且与信号输入/输出端子导通的连接电极被布置成面对衬底的上表面上的焊盘。 基板，盖，连接电极和接合焊盘与导电部件接合。
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公开(公告)号：US08295515B2
公开(公告)日：2012-10-23
申请号：US13033818
申请日：2011-02-24
申请人： Naoto Kuratani , Kazuyuki Ono , Tomofumi Maekawa
发明人： Naoto Kuratani , Kazuyuki Ono , Tomofumi Maekawa
IPC分类号： H04R25/00
CPC分类号： H04R19/04 , H01L2224/48091 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/1461 , H01L2924/3025 , H04R19/005 , H04R31/00 , H01L2924/00014 , H01L2924/00
摘要： The semiconductor device has a simplified structure which includes a package structure in which a member for mounting a semiconductor element is separate from a member including a signal input/output unit. A microphone package is configured with a cover and a substrate. A microphone chip and a circuit element are adhered and fixed to a top surface of a recess formed in the cover. A plurality of bonding pads are arranged on the lower surface of the cover on the outer side of the recess. A bonding wire is connected to the circuit element and the bonding pad. The substrate includes a signal input/output terminal serving as the signal input/output unit, and a connection electrode, conducted with the signal input/output terminal, is arranged facing the bonding pad on the upper surface of the substrate. The substrate, cover, connection electrode, and bonding pad are joined with a conductive member.
摘要翻译： 半导体器件具有简化的结构，其包括其中用于安装半导体元件的部件与包括信号输入/输出单元的部件分离的封装结构。 麦克风封装配置有盖和基板。 麦克风芯片和电路元件被粘附并固定到形成在盖中的凹部的顶表面。 在凹部的外侧的盖的下表面上设置有多个接合焊盘。 接合线连接到电路元件和接合焊盘。 基板包括用作信号输入/输出单元的信号输入/输出端子，并且与信号输入/输出端子导通的连接电极被布置成面对衬底的上表面上的焊盘。 基板，盖，连接电极和接合焊盘与导电部件接合。
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公开(公告)号：US20110217837A1
公开(公告)日：2011-09-08
申请号：US12976473
申请日：2010-12-22
申请人： Naoto Kuratani , Kazuyuki Ono , Tomofumi Maekawa
发明人： Naoto Kuratani , Kazuyuki Ono , Tomofumi Maekawa
IPC分类号： H01L21/60
CPC分类号： H01L24/03 , B81B7/007 , B81B2207/012 , B81B2207/07 , H01L21/4878 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/49833 , H01L23/552 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48471 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15153 , H01L2924/15156 , H01L2924/15165 , H01L2924/1517 , H01L2924/1617 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A connecting pad producing method has a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded, a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer, and a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member.
摘要翻译： 连接垫的制造方法具有将基材的表面中的绝缘部件突出使得形成有连接焊盘的区域被包围的第一工序，在基材的表面形成导电层的第二工序，例如 所述绝缘部件被所述导电层覆盖，以及去除所述绝缘部件的所述导电层被涂覆的第3工序，使所述绝缘部件从所述导电层的整个周边露出，以及形成包括所述导电层的所述连接焊盘 在由绝缘构件包围的区域中。
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