发明申请
US20100203296A1 TRANSFERRING STRUCTURE FOR FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE
有权
用于柔性电子器件的传输结构和用于制造柔性电子器件的方法
- 专利标题： TRANSFERRING STRUCTURE FOR FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE
- 专利标题（中）： 用于柔性电子器件的传输结构和用于制造柔性电子器件的方法
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申请号： US12488444申请日： 2009-06-19
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公开(公告)号： US20100203296A1公开(公告)日： 2010-08-12
- 发明人: Pao-Ming Tsai , Liang-You Jiang , Yu-Yang Chang , Hung-Yuan Li
- 申请人： Pao-Ming Tsai , Liang-You Jiang , Yu-Yang Chang , Hung-Yuan Li
- 申请人地址： TW Hsinchu
- 专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人地址： TW Hsinchu
- 优先权： TWTW098104140 20090210
- 主分类号： B32B3/10
- IPC分类号： B32B3/10 ; B32B38/10
摘要：
The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.
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