发明申请
US20100213808A1 Heat sink base for LEDS 有权
LEDS散热器底座

  • 专利标题: Heat sink base for LEDS
  • 专利标题(中): LEDS散热器底座
  • 申请号: US12393559
    申请日: 2009-02-26
  • 公开(公告)号: US20100213808A1
    公开(公告)日: 2010-08-26
  • 发明人: Wei Shi
  • 申请人: Wei Shi
  • 主分类号: H01J7/24
  • IPC分类号: H01J7/24 H01J9/18
Heat sink base for LEDS
摘要:
An LED assembly can include a heat sink base, at least one LED die attached to the heat sink base, and a lens. One or more layers of phosphor can be formed upon the lens. A heat sink, such as a finned heat sink, can attach the heat sink base to the lens. Heat from the LED die can flow through the heat sink base to the heat sink, from which the heat can be dissipated. Similarly, heat from phosphors can flow through the lens to the heat sink, from which the heat can be dissipated. By removing heat from the LED die, more current can be used to drive the LED die, thus providing brighter light. By removing heat from the phosphors, desired colors can be more reliably provided.
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