发明申请
- 专利标题: SUBSTRATE PROCESSING APPARATUS
- 专利标题(中): 基板加工设备
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申请号: US12706958申请日: 2010-02-17
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公开(公告)号: US20100215461A1公开(公告)日: 2010-08-26
- 发明人: Yuji KAMIKAWA , Takafumi Tsuchiya , Koji Egashira
- 申请人: Yuji KAMIKAWA , Takafumi Tsuchiya , Koji Egashira
- 申请人地址: JP Minato-ku
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Minato-ku
- 优先权: JP2009-38431 20090220
- 主分类号: H01L21/677
- IPC分类号: H01L21/677
摘要:
A substrate processing apparatus 1, which utilizes a first transfer apparatus 104A and a second transfer apparatus 104B which are configured to transfer a transfer container 10 containing a plurality of substrates, along a first transfer path 102A and a second transfer path 102B whose lateral positions differ from each other, respectively, comprises a first load port 21 where the transfer container 10 is loaded and unloaded by the first transfer apparatus 104A, and a second load port 22 that is arranged stepwise with respect to the first load port 21, the transfer container 10 being loaded to and unloaded from the second load port 22 by the second transfer apparatus 104B.
公开/授权文献
- US08851819B2 Substrate processing apparatus 公开/授权日:2014-10-07
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