发明申请
- 专利标题： PLATING APPARATUS AND PLATING METHOD
- 专利标题（中）： 电镀设备和电镀方法
-
申请号： US12771056申请日： 2010-04-30
-
公开(公告)号： US20100219078A1公开(公告)日： 2010-09-02
- 发明人: Keiichi KURASHINA , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
- 申请人： Keiichi KURASHINA , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
- 优先权： JP2004-22178 20040129; JP2004-23256 20040130
- 主分类号： C25D21/12
- IPC分类号： C25D21/12 ; C25D5/00
摘要：
A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
信息查询
