发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US12776454申请日： 2010-05-10
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公开(公告)号： US20100219538A1公开(公告)日： 2010-09-02
- 发明人: Masaru KITO , Hideaki Aochi , Takayuki Okamura
- 申请人： Masaru KITO , Hideaki Aochi , Takayuki Okamura
- 申请人地址： JP Minato-ku
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Minato-ku
- 优先权： JP2007-098227 20070404
- 主分类号： H01L23/538
- IPC分类号： H01L23/538
摘要：
A semiconductor device comprises a semiconductor layer including a plurality of paralleled linear straight sections extending in a first direction. The layer also includes a plurality of connecting sections each having a width in the first direction sufficient to form a wire-connectable contact therein and arranged to connect between adjacent ones of the straight sections in a second direction. The connecting sections have respective ends formed aligned with a first straight line parallel to the second direction.
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