发明申请
US20100220226A1 FRONT SIDE IMPLANTED GUARD RING STRUCTURE FOR BACKSIDE ILLUMINATED IMAGE SENSOR
有权
用于背面照明的图像传感器的前侧护套环形结构
- 专利标题： FRONT SIDE IMPLANTED GUARD RING STRUCTURE FOR BACKSIDE ILLUMINATED IMAGE SENSOR
- 专利标题（中）： 用于背面照明的图像传感器的前侧护套环形结构
-
申请号： US12710862申请日： 2010-02-23
-
公开(公告)号： US20100220226A1公开(公告)日： 2010-09-02
- 发明人: Wen-De WANG , Dun-Nian YAUNG , Jen-Cheng LIU , Chun-Chieh CHUANG , Jeng-Shyan LIN
- 申请人： Wen-De WANG , Dun-Nian YAUNG , Jen-Cheng LIU , Chun-Chieh CHUANG , Jeng-Shyan LIN
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H04N5/335
- IPC分类号： H04N5/335 ; H01L31/18
摘要：
An image sensor includes a semiconductor substrate, a guard ring structure in the substrate, and at least one pixel surrounded by the guard ring structure. The guard ring structure is implanted in the substrate by high-energy implantation.
公开/授权文献
信息查询
