A semiconductor cleaning method and apparatus and a controlling method of semiconductor cleaning are disclosed. The developing method includes the following steps. A developing solution is applied onto a wafer having a photoresist layer. Next, the wafer is rotated to scatter the developing solution over the photoresist layer. Then, a nozzle upon the center of the wafer ejects a non-reactive liquid onto the photoresist layer for a time period. Next, the nozzle is moved in a radial direction of the wafer to at least one next location and then ejects the liquid onto the photoresist layer for at least one next time period. The wafer is then rinsed until the developing solution and the unnecessary photoresist dissolved in the developing solution are washed away and a patterned photoresist layer is revealed.