发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PATTERNED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有图形基板的集成电路封装系统及其制造方法
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申请号： US12714291申请日： 2010-02-26
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公开(公告)号： US20100224974A1公开(公告)日： 2010-09-09
- 发明人: Il Kwon Shim , Seng Guan Chow , Heap Hoe Kuan
- 申请人： Il Kwon Shim , Seng Guan Chow , Heap Hoe Kuan
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/70
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a component side and a system side; depositing a solder resist layer on the component side of the package substrate; patterning groups of access openings and a die mount opening in the solder resist layer; attaching an integrated circuit die in the die mount opening; forming conductive contacts in the access openings; and attaching system interconnects to the system side of the package substrate including controlling a coplanarity of the system interconnects by the solder resist layer.