Invention Application
- Patent Title: CURABLE COMPOSITION
- Patent Title (中): 可固化组合物
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Application No.: US12159442Application Date: 2006-12-27
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Publication No.: US20100227949A1Publication Date: 2010-09-09
- Inventor: Hitoshi Tamai , Kohei Ogawa , Yoshiki Nakagawa
- Applicant: Hitoshi Tamai , Kohei Ogawa , Yoshiki Nakagawa
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka-shi, Osaka
- Priority: JP2005-380406 20051228
- International Application: PCT/JP2006/326116 WO 20061227
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L23/00 ; C08L33/10

Abstract:
Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).
Public/Granted literature
- US08389630B2 Curable composition Public/Granted day:2013-03-05
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